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公开(公告)号：US20160380606A1
公开(公告)日：2016-12-29
申请号：US14754241
申请日：2015-06-29
Applicant: Analog Devices Global
Inventor： Aldrick S. Limjoco , Michael Cusack , Donal G. O'Sullivan , Patrick John Meehan , Thomas Conway
IPC: H03H7/01 , H01L23/31 , H01L23/552 , H01L25/16 , H05K1/11 , H05K3/30 , H05K3/28 , H05K1/18 , H05K1/02 , H05K7/06 , H01L23/495
CPC classification number: H05K1/111 , H01L23/3107 , H01L23/49541 , H01L23/49575 , H01L23/552 , H01L25/16 , H01L2224/48247 , H01L2924/19105 , H05K1/0218 , H05K1/181 , H05K3/284 , H05K3/303 , H05K2201/1003 , H05K2201/1006
Abstract: An integrated electronic component assembly can include an electrically-conductive structure comprising two or more electrically-conductive terminals accessible on an exterior of the integrated electronic component assembly, a first component attachment region for a first component within the integrated electronic component assembly, and a second component attachment region for a second component within the integrated electronic component assembly. The integrated electronic component assembly can include an electrically-conductive magnetically-permeable shield coupled to or defined by the electrically-conductive structure, the electrically-conductive magnetically-permeable shield located between the first and second component attachment regions, including a portion extending in a direction out of a plane defined by the first and second component attachment regions, to suppress magnetic coupling between the first and second components.
Abstract translation: 集成电子部件组件可以包括导电结构，其包括可在集成电子部件组件的外部上接近的两个或更多个导电端子，用于集成电子部件组件内的第一部件的第一部件附接区域和第二部件附接区域 用于集成电子部件组件内的第二部件的部件附接区域。 集成电子部件组件可以包括耦合到导电结构或由导电结构限定的导电导磁屏蔽件，位于第一和第二部件附接区域之间的导电导磁屏蔽件，包括在 方向离开由第一和第二部件附接区域限定的平面，以抑制第一和第二部件之间的磁耦合。
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公开(公告)号：US10320280B2
公开(公告)日：2019-06-11
申请号：US15804437
申请日：2017-11-06
Applicant: Analog Devices Global Unlimited Company
Inventor： Aldrick S. Limjoco , Jefferson Albo Eco
Abstract: An LC filter circuit reduces an output voltage ripple of a switching power supply using coupled inductors in combination with a capacitor to form a notch filter, and aligning the notch region of the notch filter with a ripple frequency of the switching power supply to attenuate the frequency region of the fundamental ripple frequency by a larger amount than other frequencies.
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公开(公告)号：US09986639B2
公开(公告)日：2018-05-29
申请号：US14754241
申请日：2015-06-29
Applicant: Analog Devices Global
Inventor： Aldrick S. Limjoco , Michael Cusack , Donal G. O'Sullivan , Patrick John Meehan , Thomas Conway
IPC: H05K7/10 , H05K7/12 , H05K1/11 , H01L23/31 , H01L23/552 , H01L25/16 , H01L23/495 , H05K3/30 , H05K3/28 , H05K1/18 , H05K1/02
CPC classification number: H05K1/111 , H01L23/3107 , H01L23/49541 , H01L23/49575 , H01L23/552 , H01L25/16 , H01L2224/48247 , H01L2924/19105 , H05K1/0218 , H05K1/181 , H05K3/284 , H05K3/303 , H05K2201/1003 , H05K2201/1006
Abstract: An integrated electronic component assembly can include an electrically-conductive structure comprising two or more electrically-conductive terminals accessible on an exterior of the integrated electronic component assembly, a first component attachment region for a first component within the integrated electronic component assembly, and a second component attachment region for a second component within the integrated electronic component assembly. The integrated electronic component assembly can include an electrically-conductive magnetically-permeable shield coupled to or defined by the electrically-conductive structure, the electrically-conductive magnetically-permeable shield located between the first and second component attachment regions, including a portion extending in a direction out of a plane defined by the first and second component attachment regions, to suppress magnetic coupling between the first and second components.
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