公开(公告)号：US10725959B2

公开(公告)日：2020-07-28

申请号：US16298373

申请日：2019-03-11

Applicant: Analog Devices Global Unlimited Company

Inventor： David Aherne ,  Jofrey Santillan ,  Wes Vernon Lofamia ,  Paul O'Sullivan ,  Padraig McDaid

IPC: G06F13/42 ,  G06F13/16

Abstract: SPI Round Robin Mode for Single-Cycle MUX Channel Sequencing. SPI round robin mode is an SPI mode applicable for MUX devices control. It allows the MUX output to connect to the next input channel sequentially in just one clock cycle. Configurations can be made such as: clock edge to use (rising/falling), ascending/descending channel sequence, and enabling/disabling the channels to go through. The device supersedes an ADC with built in sequencing and is applicable to multiplexing, switching, instrumentation, process control and isolation application—while retaining SPI device control and operation.

公开(公告)号：US20190293692A1

公开(公告)日：2019-09-26

申请号：US16360356

申请日：2019-03-21

Applicant: Analog Devices Global Unlimited Company

Inventor： David J. Clarke ,  Stephen Denis Heffernan ,  Nijun Wei ,  Alan J. O'Donnell ,  Patrick Martin McGuinness ,  Shaun Bradley ,  Edward John Coyne ,  David Aherne ,  David M. Boland

IPC: G01R19/165 ,  G01R31/00 ,  G01R31/28 ,  H01L23/525 ,  H01L27/02 ,  H01L23/60 ,  H01L23/62 ,  H02H9/04

Abstract: The disclosed technology generally relates to electrical overstress protection devices, and more particularly to electrical overstress monitoring devices for detecting electrical overstress events in semiconductor devices. In one aspect, an electrical overstress monitor and/or protection device includes a two different conductive structures configured to electrically arc in response to an EOS event and a sensing circuit configured to detect a change in a physical property of the two conductive structures caused by the EOS event. The two conductive structures have facing surfaces that have different shapes;