公开(公告)号：US20050242438A1

公开(公告)日：2005-11-03

申请号：US10513453

申请日：2003-05-02

申请人： Andrea Cathelin ,  Christophe Bernard ,  Philippe Delpech ,  Pierre Troadec ,  Laurent Salager ,  Christophe Garnier

发明人： Andrea Cathelin ,  Christophe Bernard ,  Philippe Delpech ,  Pierre Troadec ,  Laurent Salager ,  Christophe Garnier

IPC分类号： H01L23/52 ,  H01G17/00 ,  H01L21/3205 ,  H01L21/4763 ,  H01L21/76 ,  H01L21/822 ,  H01L23/48 ,  H01L23/522 ,  H01L23/58 ,  H01L23/66 ,  H01L27/04 ,  H04Q7/20

CPC分类号： H01L23/5222 ,  H01L2924/0002 ,  Y10S257/906 ,  H01L2924/00

摘要： An electronic circuit comprises a substrate (100), a capacitor (11) and at least one semiconductor component (10) which are supported by a surface (S) of the substrate. A substantially plane screen (12), parallel to the surface of the substrate and made of metallic material, is furthermore placed between the capacitor and the semiconductor component. Preferably, the semiconductor component is placed in proximity to the surface (S) of the substrate and several superposed layers (1-6) of insulating material cover the surface of the substrate and the semiconductor component. The capacitor is then placed within at least one layer (5) of insulating material above the semiconductor component, and the screen (12) is placed within an intermediate layer (4) of insulating material between the layer incorporating the capacitor and the surface (S) of the substrate.

摘要翻译： 电子电路包括由衬底（100），电容器（11）和由衬底的表面（S）支撑的至少一个半导体部件（10）。 平行于基板的表面并由金属材料制成的基本平面的屏幕（12）进一步放置在电容器和半导体部件之间。 优选地，将半导体部件放置在基板的表面（S）附近，并且绝缘材料的多个叠置层（1-6）覆盖基板和半导体部件的表面。 然后将电容器放置在半导体部件上方的绝缘材料的至少一层（5）中，并且将屏幕（12）放置在包含电容器的层与表面（S）之间的绝缘材料的中间层（4）内 ）。

公开(公告)号：US07282803B2

公开(公告)日：2007-10-16

申请号：US10513453

申请日：2003-05-02

申请人： Andréa Cathelin ,  Christophe Bernard ,  Philippe Delpech ,  Pierre Troadec ,  Laurent Salager ,  Christophe Garnier

发明人： Andréa Cathelin ,  Christophe Bernard ,  Philippe Delpech ,  Pierre Troadec ,  Laurent Salager ,  Christophe Garnier

IPC分类号： H01L23/48 ,  H01L23/58 ,  H01L23/66 ,  H01L27/04

CPC分类号： H01L23/5222 ,  H01L2924/0002 ,  Y10S257/906 ,  H01L2924/00

摘要： An electronic circuit includes a substrate. A capacitor and at least one semiconductor component are supported by a surface of the substrate. A substantially planar screen, oriented parallel to the surface of the substrate and made of metallic material, is placed between the capacitor and the semiconductor component. Preferably, the semiconductor component is placed in proximity to the surface of the substrate and several superposed layers of insulating material cover the surface of the substrate and the semiconductor component. The capacitor is then placed within at least one layer of insulating material above the semiconductor component, and the screen is placed within an intermediate layer of insulating material between the layer incorporating the capacitor and the surface of the substrate.

摘要翻译： 电子电路包括基板。 电容器和至少一个半导体部件由衬底的表面支撑。 平行于基板的表面并由金属材料制成的基本平面的屏幕被放置在电容器和半导体部件之间。 优选地，将半导体部件设置在基板的表面附近，并且多个绝缘材料叠层覆盖基板的表面和半导体部件。 然后将电容器放置在半导体部件上方的至少一层绝缘材料中，并且将屏幕放置在包含电容器的层与衬底的表面之间的绝缘材料的中间层内。