MULTISTAGE COOLING OF ELECTRONIC COMPONENTS OF AN AIRCRAFT
    1.
    发明申请
    MULTISTAGE COOLING OF ELECTRONIC COMPONENTS OF AN AIRCRAFT 审中-公开
    飞机电子部件的多级冷却

    公开(公告)号:US20100044016A1

    公开(公告)日:2010-02-25

    申请号:US12514731

    申请日:2007-11-20

    IPC分类号: F28D15/00

    摘要: The invention discloses the multistage cooling of an aircraft electronic system (2) with at least one electronic component which delivers heat. The multistage feature results from the use of a plurality of circuits for transferring the waste heat. An internal coolant (14) circulating in a closed circuit which is thermally coupled to the electronic component carries heat from the at least one electronic component to a heat exchanger (6) which delivers the heat to an external coolant which flows and/or circulates from a source outside of the aircraft electronic system (2) through the heat exchanger (6) to a sink outside of the aircraft electronic system (2). The internal coolant flows from the heat exchanger (6) in the direction of the at least one electronic component and/or circulates in a closed circuit.

    摘要翻译: 本发明公开了一种具有至少一个传递热量的电子部件的飞行器电子系统(2)的多级冷却。 多级特征是由于使用多个用于传送废热的电路。 在热耦合到电子部件的闭合回路中循环的内部冷却剂(14)将热量从至少一个电子部件运送到热交换器(6),热交换器将热量传递到外部冷却剂,所述外部冷却剂从 飞机电子系统(2)外部通过热交换器(6)到飞机电子系统(2)外的水槽的源。 内部冷却剂沿着至少一个电子部件的方向从热交换器(6)流动和/或在闭合回路中循环。