摘要:
The invention discloses the multistage cooling of an aircraft electronic system (2) with at least one electronic component which delivers heat. The multistage feature results from the use of a plurality of circuits for transferring the waste heat. An internal coolant (14) circulating in a closed circuit which is thermally coupled to the electronic component carries heat from the at least one electronic component to a heat exchanger (6) which delivers the heat to an external coolant which flows and/or circulates from a source outside of the aircraft electronic system (2) through the heat exchanger (6) to a sink outside of the aircraft electronic system (2). The internal coolant flows from the heat exchanger (6) in the direction of the at least one electronic component and/or circulates in a closed circuit.
摘要:
A cooling system (10) for cooling an aircraft device (12) comprises an evaporator (14, 16, 18) for receiving a fluid (F) which is to be evaporated, a first adsorber (24) which contains a medium (28) for the adsorption of the fluid (F) which is evaporated in the evaporator (14, 16, 18), as well as a second adsorber (26) which contains a medium for the adsorption of the fluid (F) which is evaporated in the evaporator (14, 16, 18). A control system (22) is adapted to establish or to interrupt a fluid connection between the evaporator (14, 16, 18) and the first and/or the second adsorber(s) (24, 26).
摘要:
A cooling system (10) for cooling an aircraft device (12) comprises an evaporator (14, 16, 18) for receiving a fluid (F) which is to be evaporated, a first adsorber (24) which contains a medium (28) for the adsorption of the fluid (F) which is evaporated in the evaporator (14, 16, 18), as well as a second adsorber (26) which contains a medium for the adsorption of the fluid (F) which is evaporated in the evaporator (14, 16, 18). A control system (22) is adapted to establish or to interrupt a fluid connection between the evaporator (14, 16, 18) and the first and/or the second adsorber(s) (24, 26).
摘要:
The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling between an electronic device (40a, 40b, 40c, 40d, 42, 44) to be cooled and the liquid cooling system (2) of the aircraft. A coolant delivered by the liquid cooling system (2) may flow through a board of the electronic device (40a, 40b, 40c, 40d), through a heat sink on which the electronic device (42) is arranged and/or through a housing in which the electronic device (44) is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device.
摘要:
The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling between an electronic device (40a, 40b, 40c, 40d, 42, 44) to be cooled and the liquid cooling system (2) of the aircraft. A coolant delivered by the liquid cooling system (2) may flow through a board of the electronic device (40a, 40b, 40c, 40d), through a heat sink on which the electronic device (42) is arranged and/or through a housing in which the electronic device (44) is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device.
摘要:
The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling between an electronic device (40a, 40b, 40c, 40d, 42, 44) to be cooled and the liquid cooling system (2) of the aircraft. A coolant delivered by the liquid cooling system (2) may flow through a board of the electronic device (40a, 40b, 40c, 40d), through a heat sink on which the electronic device (42) is arranged and/or through a housing in which the electronic device (44) is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporise at least partially while cooling the electronic device.
摘要:
The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling between an electronic device (40a, 40b, 40c, 40d, 42, 44) to be cooled and the liquid cooling system (2) of the aircraft. A coolant delivered by the liquid cooling system (2) may flow through a board of the electronic device (40a, 40b, 40c, 40d), through a heat sink on which the electronic device (42) is arranged and/or through a housing in which the electronic device (44) is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device.
摘要:
The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling between an electronic device (40a, 40b, 40c, 40d, 42, 44) to be cooled and the liquid cooling system (2) of the aircraft. A coolant delivered by the liquid cooling system (2) may flow through a board of the electronic device (40a, 40b, 40c, 40d), through a heat sink on which the electronic device (42) is arranged and/or through a housing in which the electronic device (44) is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device.
摘要:
The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling between an electronic device (40a, 40b, 40c, 40d, 42, 44) to be cooled and the liquid cooling system (2) of the aircraft. A coolant delivered by the liquid cooling system (2) may flow through a board of the electronic device (40a, 40b, 40c, 40d), through a heat sink on which the electronic device (42) is arranged and/or through a housing in which the electronic device (44) is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device.
摘要:
The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system, the aircraft electronics cooling system providing a thermal coupling between an electronic device to be cooled and the liquid cooling system of the aircraft. A coolant delivered by the liquid cooling system may flow through a board of the electronic device, through a heat sink on which the electronic device is arranged and/or through a housing in which the electronic device is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device.