Microelectromechanical resonant structure having improved electrical characteristics
    1.
    发明授权
    Microelectromechanical resonant structure having improved electrical characteristics 有权
    具有改善的电特性的微机电谐振结构

    公开(公告)号:US08289092B2

    公开(公告)日:2012-10-16

    申请号:US12953930

    申请日:2010-11-24

    IPC分类号: H03B5/30 H01L41/02

    摘要: The present disclosure is directed to a MEMS resonant structure, provided with a substrate of semiconductor material; a mobile mass suspended above the substrate and anchored to the substrate by constraint elements to be free to oscillate at a resonance frequency; and a fixed-electrode structure capacitively coupled to the mobile mass to form a capacitor with a capacitance that varies as a function of the oscillation of the mobile mass; the fixed-electrode structure arranged on a top surface of the substrate, and the constraint elements being configured in such a way that the mobile mass oscillates, in use, in a vertical direction, transverse to the top surface of the substrate, keeping substantially parallel to the top surface.

    摘要翻译: 本公开涉及一种设置有半导体材料的衬底的MEMS谐振结构; 悬浮在衬底上方并通过约束元件锚固到衬底以便以共振频率自由振荡的移动质量; 以及电容耦合到所述移动质量块的固定电极结构,以形成电容器,所述电容器随着所述移动质量块的振荡而变化; 所述固定电极结构布置在所述衬底的顶表面上,并且所述约束元件被配置成使得所述移动质量块在使用中在垂直方向上垂直于所述衬底的顶表面振荡,保持基本平行 到顶面。

    MICROELECTROMECHANICAL RESONANT STRUCTURE HAVING IMPROVED ELECTRICAL CHARACTERISTICS
    2.
    发明申请
    MICROELECTROMECHANICAL RESONANT STRUCTURE HAVING IMPROVED ELECTRICAL CHARACTERISTICS 有权
    具有改善电气特性的微电子谐振结构

    公开(公告)号:US20110128083A1

    公开(公告)日:2011-06-02

    申请号:US12953930

    申请日:2010-11-24

    IPC分类号: H03B5/30 H01L21/02 H01L29/84

    摘要: The present disclosure is directed to a MEMS resonant structure, provided with a substrate of semiconductor material; a mobile mass suspended above the substrate and anchored to the substrate by constraint elements to be free to oscillate at a resonance frequency; and a fixed-electrode structure capacitively coupled to the mobile mass to form a capacitor with a capacitance that varies as a function of the oscillation of the mobile mass; the fixed-electrode structure arranged on a top surface of the substrate, and the constraint elements being configured in such a way that the mobile mass oscillates, in use, in a vertical direction, transverse to the top surface of the substrate, keeping substantially parallel to the top surface.

    摘要翻译: 本公开涉及一种设置有半导体材料的衬底的MEMS谐振结构; 悬浮在衬底上方并通过约束元件锚固到衬底以便以共振频率自由振荡的移动质量; 以及电容耦合到所述移动质量块的固定电极结构,以形成电容器,所述电容器随着所述移动质量块的振荡而变化; 所述固定电极结构布置在所述衬底的顶表面上,并且所述约束元件被配置成使得所述移动质量块在使用中在垂直方向上垂直于所述衬底的顶表面振荡,保持基本平行 到顶面。

    SURFACE ACOUSTIC WAVE PRESSURE SENSOR
    3.
    发明申请
    SURFACE ACOUSTIC WAVE PRESSURE SENSOR 有权
    表面声波式压力传感器

    公开(公告)号:US20070113658A1

    公开(公告)日:2007-05-24

    申请号:US11531808

    申请日:2006-09-14

    IPC分类号: G01L11/00

    CPC分类号: G01L9/0025

    摘要: A surface acoustic wave pressure sensor includes: a substrate and at least one flexible membrane, suspended over a cavity defined in the thickness of the substrate, the membrane being elastically deformable by a pressure applied by a fluid and being defined between a first surface facing the cavity and a second opposite surface; a SAW device comprising a layer of piezoelectric material arranged on the second surface of the membrane, the SAW device further comprising at least one SAW electro-acoustic transducer formed on one free surface of the piezoelectric layer. The piezoelectric layer is formed by deposition of piezoelectric material on the membrane and the substrate is integrated in a chip of semiconductor material, the membrane being a layer of the chip suspended over the cavity.

    摘要翻译: 表面声波压力传感器包括:衬底和至少一个柔性膜,其悬挂在限定在衬底的厚度上的空腔上,所述膜可通过由流体施加的压力弹性变形,并且限定在面向 空腔和第二相对表面; 一种SAW器件,包括布置在膜的第二表面上的压电材料层,SAW器件还包括形成在压电层的一个自由表面上的至少一个SAW电声换能器。 压电层通过在膜上沉积压电材料而形成,并且衬底集成在半导体材料芯片中,该膜是悬挂在空腔上的芯片层。