公开(公告)号：US20020144032A1

公开(公告)日：2002-10-03

申请号：US09821784

申请日：2001-03-28

Applicant: Apple Computer, Inc.

Inventor： Michael Kriege ,  Dan Hong ,  John DiFonzo ,  Stephen Zadesky ,  David Lynch ,  David Lundgren ,  Nick Merz

IPC: G06F013/12 ,  A47B097/00

CPC classification number: G06F1/1616 ,  G06F1/1656 ,  G06F1/1679 ,  G06F1/182 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49171

Abstract: A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.

Abstract translation: 公开了一种具有改进的外壳布置的计算设备。 外壳的一个方面涉及在结构上结合在一起以形成单一复合结构的外壳部件。 在一个实施例中，结构胶用于将至少两个独特部分粘合在一起。 外壳的另一方面涉及电结合在一起以形成单一的集成导电构件的外壳部件。 在一个实施例中，使用导电膏将至少两个独特部分粘合在一起。 改进的外壳在诸如膝上型计算机的便携式计算设备中特别有用。

公开(公告)号：US20020154474A1

公开(公告)日：2002-10-24

申请号：US09842408

申请日：2001-04-24

Applicant: Apple Computer, Inc.

Inventor： Nick Merz ,  John DiFonzo ,  Stephen Zadesky ,  Michael Prichard

IPC: G06F001/16 ,  G02F001/1333

CPC classification number: G06F1/20 ,  F28D15/02 ,  F28D15/0275 ,  F28F3/02 ,  G02F1/133308 ,  G02F2201/503 ,  G06F1/1616 ,  G06F1/1637 ,  G06F1/1656 ,  G06F1/1658 ,  G06F1/1662 ,  G06F1/1681 ,  G06F1/183 ,  G06F1/184 ,  G06F1/187 ,  G06F1/203 ,  G11B33/08 ,  G11B33/1426 ,  H01L23/367 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20336 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

Abstract translation: 公开了一种计算设备。 该计算装置包括一个冲击安装组件，其被配置为向诸如显示器和光盘驱动器的敏感部件提供冲击吸收。 计算设备还包括由机壳和计算设备的其他结构容纳的无外壳光盘驱动器。 计算装置还包括从计算装置的发热元件移除热量的传热系统。 传热系统被配置为将发热元件热耦合到计算装置的结构构件，以便通过结构构件吸收热量，结构构件通常具有用于散热的大的表面积。