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公开(公告)号:US11134328B2
公开(公告)日:2021-09-28
申请号:US16878556
申请日:2020-05-19
Applicant: Apple Inc.
Inventor: Jared M. Kole , Daniel R. Bloom , Audrey L. Sheng , Tian Shi Li , Eugene Antony Whang , Edward Siahaan , Phillip Qian , Alex C. Hellwig , Oliver M. Hewitt , Yuta Kuboyama , Christopher S. Erickson , Sneha Kadetotad , Edwin J. Corona Aparicio , Rajesh Anantharaman , Jacob E. Mattingley , Tsu-Hui Lin , Robert D. Zupke , Dustin A. Hatfield , Axit H. Patel
IPC: H04R1/10 , H04R5/033 , H04R5/04 , G10K11/178
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号:US20200280786A1
公开(公告)日:2020-09-03
申请号:US16878556
申请日:2020-05-19
Applicant: Apple Inc.
Inventor: Jared M. Kole , Daniel R. Bloom , Audrey L. Sheng , Tian Shi Li , Eugene Antony Whang , Edward Siahaan , Phillip Qian , Alex C. Hellwig , Oliver M. Hewitt , Yuta Kuboyama , Christopher S. Erickson , Sneha Kadetotad , Edwin J. Corona Aparicio , Rajesh Anantharaman , Jacob E. Mattingley , Tsu-Hui Lin , Robert D. Zupke , Dustin A. Hatfield , Axit H. Patel
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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