公开(公告)号：US10090358B2

公开(公告)日：2018-10-02

申请号：US15234790

申请日：2016-08-11

Applicant: Apple Inc.

Inventor： Annabelle Q. Yang ,  Steven Webster ,  Reynaldo Vincent H. Sta Agueda ,  Christopher Hunat

IPC: H01L27/146 ,  H04N5/225

Abstract: A camera module assembly including a circuit carrier substrate having a first region integrally formed with a second region, the second region being movable with respect to the first region. The camera module assembly may further include an image sensor device positioned within a cavity formed in the first region of the circuit carrier substrate. The image sensor device may have a conductive via and a redistribution layer formed therein. The conductive via and the redistribution layer are electrically connected to the circuit carrier substrate along the side of the image sensor device facing the circuit carrier substrate. The camera module assembly further includes an electronic component positioned within a second cavity formed in the first region, the electronic component being electrically connected to the circuit carrier substrate.

公开(公告)号：US20170048472A1

公开(公告)日：2017-02-16

申请号：US15234790

申请日：2016-08-11

Applicant: Apple Inc.

Inventor： Annabelle Q. Yang ,  Steven Webster ,  Reynaldo Vincent H. Sta Agueda ,  Christopher Hunat

IPC: H04N5/369 ,  H04N5/225 ,  H01L27/146

CPC classification number: H01L27/14687 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14645 ,  H01L2224/16225 ,  H01L2224/73204 ,  H04N5/2253 ,  H04N5/2257

Abstract: A camera module assembly including a circuit carrier substrate having a first region integrally formed with a second region, the second region being movable with respect to the first region. The camera module assembly may further include an image sensor device positioned within a cavity formed in the first region of the circuit carrier substrate. The image sensor device may have a conductive via and a redistribution layer formed therein. The conductive via and the redistribution layer are electrically connected to the circuit carrier substrate along the side of the image sensor device facing the circuit carrier substrate. The camera module assembly further includes an electronic component positioned within a second cavity formed in the first region, the electronic component being electrically connected to the circuit carrier substrate.

Abstract translation: 一种相机模块组件，包括具有与第二区域整体形成的第一区域的电路载体基板，所述第二区域可相对于所述第一区域移动。 相机模块组件还可以包括定位在形成在电路载体基板的第一区域中的空腔内的图像传感器装置。 图像传感器装置可以具有形成在其中的导电通孔和再分布层。 导电通孔和再分配层沿着图像传感器装置面向电路载体衬底的一侧电连接到电路载体衬底。 相机模块组件还包括位于形成在第一区域中的第二空腔内的电子部件，电子部件电连接到电路载体基板。