公开(公告)号：US20170015006A1

公开(公告)日：2017-01-19

申请号：US15282225

申请日：2016-09-30

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  David Albertalli

IPC: B25J15/00 ,  H02N13/00 ,  H01L23/00 ,  B81C99/00 ,  H01L21/67

CPC classification number: B25J15/0085 ,  B81C99/002 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67259 ,  H01L24/75 ,  H01L24/95 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75753 ,  H01L2224/7598 ,  H02N13/00

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.

Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，传质工具包括铰接传送头组件，载体衬底保持器和致动器组件，以调节关节式传送头组件和载体衬底保持器之间的空间关系。 铰接传送头组件可以包括静电电压源连接和支撑静电转印头阵列的基片。

公开(公告)号：US10183401B2

公开(公告)日：2019-01-22

申请号：US15282225

申请日：2016-09-30

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  David Albertalli

IPC: B25J15/00 ,  B81C99/00 ,  H01L23/00 ,  H02N13/00 ,  H01L21/67

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.