MAGNETICALLY ACTUATED RESTRAINING MECHANISMS

    公开(公告)号:US20170092401A1

    公开(公告)日:2017-03-30

    申请号:US15141696

    申请日:2016-04-28

    Applicant: Apple Inc.

    Inventor: David S. HERMAN

    CPC classification number: H01F7/0205 H01F7/0252 H01F7/20

    Abstract: Some embodiments can include a retention mechanism having a first component including a first clasping surface and a first magnet having a first polarity as well as a second component having a second clasping surface configured to be alignable to and to coordinate with the first clasping surface. The second component can have a magnetic assembly having an effective polarity that varies in accordance with a electric current pulse received at the magnetic assembly, where a magnetic circuit is formed between the first magnet and the magnetic assembly, and where when the effective polarity of the magnetic assembly is the first polarity, the magnetic circuit is repulsive causing the first and second clasping surfaces to separate otherwise, the magnetic circuit is attractive causing the clasping surfaces to come together.

    USING MAGNETIC FIELDS TO INCREASE THE BONDING AREA OF AN ADHESIVE JOINT

    公开(公告)号:US20200024492A1

    公开(公告)日:2020-01-23

    申请号:US16194153

    申请日:2018-11-16

    Applicant: Apple Inc.

    Abstract: This application relates to an assembly technique for joining parts using a magnetic adhesive. A liquid adhesive including magnetic particles is provided, the liquid adhesive having sufficient properties that allow the adhesive to flow under the influence of a magnetic field prior to curing. A method for joining parts includes the steps of applying an adhesive to a substrate at a location corresponding to the joint, placing a magnetic element proximate the joint to generate a magnetic field that interacts with the magnetic particles in the adhesive to cause the adhesive to flow in a direction corresponding to the magnetic field, and curing the magnetic adhesive under the influence of the magnetic field. An assembly fixture for joining parts includes a magnetic element and, optionally, an inductive heating element. The assembly technique can be used to form a housing of an electronic device from two or more components.

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