公开(公告)号：US20200024492A1

公开(公告)日：2020-01-23

申请号：US16194153

申请日：2018-11-16

Applicant: Apple Inc.

Inventor： John C. DIFONZO ,  Tyler J. EWING ,  Nathan MORRIS ,  David S. HERMAN

IPC: C09J9/00 ,  C09J11/04 ,  C09J5/06 ,  H05K5/00 ,  H05K1/18 ,  H05K3/30

Abstract: This application relates to an assembly technique for joining parts using a magnetic adhesive. A liquid adhesive including magnetic particles is provided, the liquid adhesive having sufficient properties that allow the adhesive to flow under the influence of a magnetic field prior to curing. A method for joining parts includes the steps of applying an adhesive to a substrate at a location corresponding to the joint, placing a magnetic element proximate the joint to generate a magnetic field that interacts with the magnetic particles in the adhesive to cause the adhesive to flow in a direction corresponding to the magnetic field, and curing the magnetic adhesive under the influence of the magnetic field. An assembly fixture for joining parts includes a magnetic element and, optionally, an inductive heating element. The assembly technique can be used to form a housing of an electronic device from two or more components.

公开(公告)号：US20160342179A1

公开(公告)日：2016-11-24

申请号：US15160054

申请日：2016-05-20

Applicant: Apple Inc.

Inventor： Steven J. OSBORNE ,  Joss N. GIDDINGS ,  Adam T. GARELLI ,  William F. LEGGETT ,  Sarah J. MONTPLAISIR ,  Eric T. CORRIVEAU ,  Tyler J. EWING

IPC: G06F1/16

CPC classification number: G06F1/16 ,  B23K1/0016 ,  B23K1/06 ,  B23K1/19 ,  B23K20/10 ,  B23K20/106 ,  B23K20/227 ,  B23K20/2275 ,  B23K20/233 ,  B23K20/2336 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/18 ,  G06F1/1633

Abstract: Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

Abstract translation: 公开了将电子设备的外壳中的结构特征结合在一起的技术。 结构特征可以被超声波焊接到外壳以提供结构支撑并在该装置内形成磁路。 此外，超声波焊接可以将各种特征粘合到外壳的内部区域，而不会在对应于各种特征的位置处留下标记或迹线到外壳的外部区域。 此外，一个或多个特征可以被驱动以抵靠外壳，以通过摩擦焊接来接合一个或多个特征。 此外，旋转摩擦焊接机可以将具有相对较小直径的特征以相对较高的速度旋转到外壳上，以将特征驱动到外壳中，并将该特征与外壳摩擦焊接。 此外，摩擦焊接在外部区域上不会留下任何外观的化妆品变形。