公开(公告)号：US20160307819A1

公开(公告)日：2016-10-20

申请号：US15191404

申请日：2016-06-23

Applicant: Apple Inc.

Inventor： Jay S. NIGEN ,  Ron A. HOPKINSON ,  Derek J. YAP ,  Eric A. KNOPF ,  William F. LEGGETT ,  Richard H. TAN

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/552

CPC classification number: H01L23/3735 ,  F28F21/00 ,  G06F1/20 ,  H01L21/4882 ,  H01L23/3737 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/0061 ,  H05K7/20436 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10159 ,  H01L2924/00

Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.