公开(公告)号：US20140079508A1

公开(公告)日：2014-03-20

申请号：US14071871

申请日：2013-11-05

Applicant: Apple Inc.

Inventor： Brett W. DEGNER ,  Houtan R. FARAHANI ,  Ron A. HOPKINSON ,  William F. LEGGETT

IPC: H05K5/02 ,  F16B39/02

CPC classification number: H05K5/0217 ,  F16B5/025 ,  F16B19/02 ,  F16B33/002 ,  F16B33/02 ,  F16B37/042 ,  F16B37/043 ,  F16B37/048 ,  F16B39/02 ,  G06F1/1613

Abstract: One or more fastenings can be used to fasten components together, such as housing components on a computing device. Each fastening can include a first opening associated with a first component, a second opening associated with a second component, a floating fastener, and a screw. The floating fastener is inserted into the first opening and/or second opening, and includes a threaded opening therein having a primary axis therethrough. The screw is inserted through first and/or second openings and into the threaded opening in the floating fastener. The screw and threaded opening combination is defined by contact between the screw and threaded opening about a thread surface that is substantially perpendicular to the primary axis, a screw thread return angle of 45 degrees or less, and a thread depth that is less than about triple the float between the major diameters of the screw and the threaded opening.

Abstract translation: 可以使用一个或多个紧固件将部件固定在一起，例如在计算设备上的壳体部件。 每个紧固件可以包括与第一部件相关联的第一开口，与第二部件相关联的第二开口，浮动紧固件和螺钉。 浮动紧固件插入第一开口和/或第二开口中，并且包括其中具有主轴线的螺纹开口。 螺钉通过第一和/或第二开口插入浮动紧固件中的螺纹孔中。 螺钉和螺纹开口组合由螺钉和螺纹开口围绕基本上垂直于主轴线的螺纹表面，45度或更小的螺纹返回角度以及小于约三倍的螺纹深度的接触限定 在螺杆的大直径和螺纹开口之间的浮子。

公开(公告)号：US20180068811A1

公开(公告)日：2018-03-08

申请号：US15812914

申请日：2017-11-14

Applicant: Apple Inc.

Inventor： Christiaan A. LIGTENBERG ,  Mikael M. SILVANTO ,  Ron A. HOPKINSON ,  Nicholas Alan RUNDLE

IPC: H01H13/86

CPC classification number: H01H13/86 ,  G06F1/1616 ,  G06F1/1656 ,  G06F1/1662 ,  G06F3/02 ,  H01H11/00 ,  H01H13/702 ,  H01H13/705 ,  H01H13/785 ,  H01H13/79 ,  H01H13/83 ,  H01H13/88 ,  H01H2223/036 ,  H01H2223/04 ,  H01H2231/002

Abstract: Embodiments of keyboards having variations of electrically connecting keys to an internal component of an electronic device are described. Some embodiments include positioning several rows of conductive layers below several rows of keys. The conductive layers may be configured to receive a signal indicating a key has been depressed. Also, the internal component may be configured to scan the conductive layers to determine whether a key or keys have been depressed. In some embodiments, the conductive layers lie outside a portion of the electronic device in which internal components are traditionally located. In some embodiments, a substrate may be integrally connected with the keyboard. The substrate may receive some internal components of the electronic device.

公开(公告)号：US20140077670A1

公开(公告)日：2014-03-20

申请号：US14086353

申请日：2013-11-21

Applicant: Apple Inc.

Inventor： Brett W. DEGNER ,  Christiaan A. LIGTENBERG ,  Ron A. HOPKINSON ,  Bartley K. ANDRE ,  Jeremy BATAILLOU ,  Jay S. NIGEN ,  Matthew S. THEOBALD ,  Matthew P. CASEBOLT ,  Charles A. SCHWALBACH ,  Brandon S. SMITH ,  William F. LEGGETT

IPC: G06F1/16

CPC classification number: G06F1/1613 ,  G06F1/1616 ,  G06F2200/1612 ,  Y10T29/49 ,  Y10T29/49002

Abstract: The present application describes various embodiments regarding systems and methods for providing a lightweight and durable portable computing device having a thin profile. The portable computing device can take the form of a laptop computer. The laptop computer can include a uni-body top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing.

Abstract translation: 本申请描述了关于用于提供具有薄型材的轻便且耐用的便携式计算设备的系统和方法的各种实施例。 便携式计算设备可以采用膝上型计算机的形式。 膝上型计算机可以包括其上形成有集成的支撑系统的单体顶部壳体，该集成的支撑系统提供结构支撑，其通过顶部壳体分配所施加的负载以防止翘曲和弯曲。

公开(公告)号：US20230413416A1

公开(公告)日：2023-12-21

申请号：US17843884

申请日：2022-06-17

Applicant: Apple Inc.

Inventor： Trevor J. EDMONDS ,  Jay S. NIGEN ,  Richard D. KOSOGLOW ,  Ron A. HOPKINSON

IPC: H05K1/02 ,  H05K7/20 ,  G06F1/20

CPC classification number: H05K1/0203 ,  H05K7/2039 ,  G06F1/203 ,  H05K2201/10128

Abstract: An assembly for heat-generating components includes a metal and a non-metal layer. To secure to a circuit board that carries a heat-generating component, a metal standoff is secured on a perimeter of the circuit board. Multiple protruding elements of the metal layer of the assembly secure within a respective opening of the standoff. The assembly secures, through metal-to-metal contact, to the standoff by multiple mechanical couplings. The assembly not only covers the circuit board, but also extends laterally beyond the circuit board (and the circuit board components). As a result, the assembly receives thermal energy from a heat-generating component(s) on the circuit board and allows the thermal energy to flow through assembly from one portion of the assembly covering the heat-generating component(s) to the lateral portion of the assembly that does not cover the heat-generating component(s).

公开(公告)号：US20160307819A1

公开(公告)日：2016-10-20

申请号：US15191404

申请日：2016-06-23

Applicant: Apple Inc.

Inventor： Jay S. NIGEN ,  Ron A. HOPKINSON ,  Derek J. YAP ,  Eric A. KNOPF ,  William F. LEGGETT ,  Richard H. TAN

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/552

CPC classification number: H01L23/3735 ,  F28F21/00 ,  G06F1/20 ,  H01L21/4882 ,  H01L23/3737 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/0061 ,  H05K7/20436 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10159 ,  H01L2924/00

Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.