公开(公告)号：US20180070472A1

公开(公告)日：2018-03-08

申请号：US15682291

申请日：2017-08-21

Applicant: Apple Inc.

Inventor： Anthony J. AIELLO ,  Jonathan L. BERK ,  Karen CHENG ,  Jesse T. DYBENKO ,  Trevor EDMONDS ,  Kwonil D. FLEISCHMAN ,  Richard A. HERMS ,  Eric A. KNOPF ,  Arash NAGHIB LAHOUTI ,  Brad L. PATTON

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20145 ,  F04D17/16 ,  F04D25/0613 ,  F04D29/441 ,  G06F1/1658 ,  G06F1/1662 ,  G06F1/20 ,  G06F1/203 ,  H01L23/4006 ,  H01L23/467

Abstract: In an exemplary electronic device with a cooling fan, a fan assembly is attached to a keyboard assembly of the electronic device. The fan assembly includes an impeller at least partially inside a fan enclosure. The fan enclosure has, on a surface, an inlet opening and an external protrusion. The electronic device further includes a bottom case. The fan assembly is positioned between the keyboard assembly and the bottom case and oriented such that the inlet opening and the external protrusion face the bottom case. The external protrusion maintains a passage between the fan enclosure and the bottom case that allows air to enter the inlet opening and also resists interference between the rotating impeller and the stationary bottom case.

公开(公告)号：US20200100383A1

公开(公告)日：2020-03-26

申请号：US16583155

申请日：2019-09-25

Applicant: Apple Inc.

Inventor： Daniel D. HERSHEY ,  Christoph M. PISTOR ,  Bartley K. ANDRE ,  Richard D. KOSOGLOW ,  Michael D. MCBROOM ,  Shravan BHARADWAJ ,  Jonathan L. BERK ,  Houtan R. FARAHANI ,  James M. CUSEO ,  William R. ALLAN, II ,  David C. PARELL ,  Eric A. KNOPF ,  Seth G. MCFARLAND

IPC: H05K7/16 ,  H05K7/14 ,  H05K9/00

Abstract: A rack system for one or more computing systems is described. The rack system may include support structures, or rack structures, and a housing affixed or un-affixed to the support structures. The rack system may include rails, including telescoping rails, affixed to the support structures and coupled to the computing system. When the rack system is in a closed position, the computing system is positioned within the housing. When the rack system is in an open position, the computing system is removed from the housing and the components of the computing system are accessible. In the open position, only components on one surface of the circuit board are accessible. However, the computing system can rotate, thereby placing the components on the opposing surface of the circuit board in an accessible position. Alternatively, the housing can be affixed to the computing system, and include modifications for access to the computing system.

公开(公告)号：US20160307819A1

公开(公告)日：2016-10-20

申请号：US15191404

申请日：2016-06-23

Applicant: Apple Inc.

Inventor： Jay S. NIGEN ,  Ron A. HOPKINSON ,  Derek J. YAP ,  Eric A. KNOPF ,  William F. LEGGETT ,  Richard H. TAN

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/552

CPC classification number: H01L23/3735 ,  F28F21/00 ,  G06F1/20 ,  H01L21/4882 ,  H01L23/3737 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/0061 ,  H05K7/20436 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10159 ,  H01L2924/00

Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.

公开(公告)号：US20130286577A1

公开(公告)日：2013-10-31

申请号：US13887172

申请日：2013-05-03

Applicant: Apple Inc.

Inventor： Chiew-Siang Goh ,  Houtan R. FARAHANI ,  Eric A. KNOPF ,  Ricardo A. MARIANO ,  Joseph B. MOAK ,  Matthew S. THEOBALD

IPC: G06F1/16 ,  H05K13/00

CPC classification number: H05K7/20336 ,  B23C3/30 ,  B23C5/08 ,  B23C2220/36 ,  B26D3/14 ,  G06F1/16 ,  G06F1/181 ,  G06F1/182 ,  G06F1/185 ,  G06F1/187 ,  G06F1/20 ,  G06F1/203 ,  H05K13/00 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49169 ,  Y10T29/49826 ,  Y10T83/04 ,  Y10T83/869 ,  Y10T83/9391

Abstract: An aesthetically pleasing small form factor desktop computer is described. The small form factor desktop computer can be formed of a single piece seamless housing that in the described embodiment is machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic (EM) shielding. This simplicity of design can accrue many advantages to the small form factor desktop computer besides those related to aesthetic look and feel. Fewer components and less time and effort can be required for assembly of the small form factor desktop computer and the absence of seams in the single piece housing can provide good protection against environmental contamination of internal components as well as EM shielding.

Abstract translation: 描述了美观的小型台式计算机。 小型台式计算机可以由单件无缝外壳形成，在所述实施例中，由单个铝合金坯加工。 单件无缝外壳包括美观的脚部支撑件，其具有由RF透明材料形成的至少一部分，其提供用户对所选择的内部部件的访问以及提供电磁（EM）屏蔽。 除了与美学外观相关的设计外，这种简单的设计可以为小型台式电脑带来许多优点。 组装小型台式计算机可能需要更少的组件和更少的时间和精力，并且在单件外壳中不存在接缝可以提供良好的防止内部组件的环境污染以及EM屏蔽的保护。