公开(公告)号：US20240421013A1

公开(公告)日：2024-12-19

申请号：US18585834

申请日：2024-02-23

Applicant: Apple Inc.

Inventor： Jixuan Gong ,  Vidhya Ramachandran ,  Jie-Hua Zhao ,  Young Doo Jeon ,  Wei Chen ,  Jun Zhai

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/522 ,  H01L23/58

Abstract: Integrated circuit (IC) structure, IC die structures and methods of fabrication are described in which one or more edge recesses are formed in an IC die. Upon direct bonding to an electronic component, a molding compound can be applied to the bonded structure where the molding compound fills the one or more edge recesses and encroached underneath the IC die and between the IC die and the electronic component.