公开(公告)号：US11277679B1

公开(公告)日：2022-03-15

申请号：US17023246

申请日：2020-09-16

申请人： Apple Inc.

发明人： Jarrett B. Lagler ,  Michael B. Minerbi ,  Miikka O. Tikander ,  Lee M. Panecki ,  Trang Fisher ,  Esge Andersen ,  Eugene Whang ,  Ben Shaffer ,  Edward Siahaan ,  Daniel R. Bloom ,  Kitty Yung ,  Tyler A. Green ,  Krithika Elangovan ,  Sarah Gysbers ,  Michael Burello ,  Matthew Zaverl ,  Christopher A. Sandieson ,  Casey L. Baran

IPC分类号： H04R1/10

摘要： A headphone earcup including a frame defining a cavity dimensioned to surround an ear of a user; a damping component coupled to the frame and encircling the cavity; a wrap component that covers the damping component and defines a continuous acoustic opening around the cavity to acoustically connect the cavity to the damping component; and a cosmetic component that covers the wrap component and the continuous acoustic opening.

公开(公告)号：US20220086551A1

公开(公告)日：2022-03-17

申请号：US17023246

申请日：2020-09-16

申请人： Apple Inc.

发明人： Jarrett B. Lagler ,  Michael B. Minerbi ,  Miikka O. Tikander ,  Lee M. Panecki ,  Trang Fisher ,  Esge Andersen ,  Eugene Whang ,  Ben Shaffer ,  Edward Siahaan ,  Daniel R. Bloom ,  Kitty Yung ,  Tyler A. Green ,  Krithika Elangovan ,  Sarah Gysbers ,  Michael Burello ,  Matthew Zaverl ,  Christopher A. Sandieson ,  Casey L. Baran

IPC分类号： H04R1/10

摘要： A headphone earcup including a frame defining a cavity dimensioned to surround an ear of a user; a damping component coupled to the frame and encircling the cavity; a wrap component that covers the damping component and defines a continuous acoustic opening around the cavity to acoustically connect the cavity to the damping component; and a cosmetic component that covers the wrap component and the continuous acoustic opening.