Speaker clip
    3.
    发明授权

    公开(公告)号:US09386362B2

    公开(公告)日:2016-07-05

    申请号:US13902966

    申请日:2013-05-27

    Applicant: Apple Inc.

    Abstract: Certain embodiments may take the form of an electronic device having a main housing encapsulating operative circuitry for the device. The electronic device includes an attachment member moveably coupled to the metal housing. The attachment member has an acoustical device located therein that is communicatively coupled to the operative circuitry in the main housing. The attachment member includes a recessed portion for positioning the acoustical device within the attachment member.

    SPEAKER CLIP
    4.
    发明申请
    SPEAKER CLIP 审中-公开

    公开(公告)号:US20160234585A1

    公开(公告)日:2016-08-11

    申请号:US15134928

    申请日:2016-04-21

    Applicant: Apple Inc.

    Abstract: Certain embodiments may take the form of an electronic device having a main housing encapsulating operative circuitry for the device. The electronic device includes an attachment member moveably coupled to the metal housing. The attachment member has an acoustical device located therein that is communicatively coupled to the operative circuitry in the main housing. The attachment member includes a recessed portion for positioning the acoustical device within the attachment member.

    SPEAKER CLIP
    9.
    发明申请
    SPEAKER CLIP 审中-公开
    扬声器夹

    公开(公告)号:US20130259281A1

    公开(公告)日:2013-10-03

    申请号:US13902966

    申请日:2013-05-27

    Applicant: Apple Inc.

    Abstract: Certain embodiments may take the form of an electronic device having a main housing encapsulating operative circuitry for the device. The electronic device includes an attachment member moveably coupled to the metal housing. The attachment member has an acoustical device located therein that is communicatively coupled to the operative circuitry in the main housing. The attachment member includes a recessed portion for positioning the acoustical device within the attachment member.

    Abstract translation: 某些实施例可以采用电子设备的形式,其具有封装用于该设备的操作电路的主壳体。 电子设备包括可移动地联接到金属外壳的附接构件。 附接构件具有位于其中的声学装置,其通信地联接到主壳体中的操作电路。 附接构件包括用于将声学装置定位在附接构件内的凹部。

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