Enclosure detection for reliable optical failsafe

    公开(公告)号:US11867650B2

    公开(公告)日:2024-01-09

    申请号:US17223674

    申请日:2021-04-06

    申请人: Apple Inc.

    摘要: Optical component integrity monitoring circuitry monitors an optical component integrity sensing path in an optical component. If a rise in resistance of the sensing path is detected, the circuitry prevents the optical component from emitting light. The optical component may have a light-emitting device that emits light through an optical element. The sensing path may have a first path that is used to detect damage to the optical element and a second path that is coupled to a package covering the optical element and light-emitting device. The first path may have a segment formed from a metal trace on the optical element and a segment formed from a wire bond, providing mechanical compliance to tolerate strains expected in the use case. The second path ensures that the package is present to constrain movement of the optical element and its wires within a safe envelope defined by the package interior.

    Beam-Tilting Light Source Enclosures
    2.
    发明公开

    公开(公告)号:US20230280492A1

    公开(公告)日:2023-09-07

    申请号:US18197882

    申请日:2023-05-16

    申请人: Apple, Inc.

    摘要: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.

    Beam-Tilting Light Source Enclosures

    公开(公告)号:US20220283335A1

    公开(公告)日:2022-09-08

    申请号:US17751820

    申请日:2022-05-24

    申请人: Apple Inc.

    IPC分类号: G01V8/12 F21V5/04 F21V3/02

    摘要: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.

    Enclosure Detection for Reliable Optical Failsafe

    公开(公告)号:US20240094153A1

    公开(公告)日:2024-03-21

    申请号:US18521585

    申请日:2023-11-28

    申请人: Apple Inc.

    IPC分类号: G01N27/04 G01R31/26 G02B5/02

    摘要: Optical component integrity monitoring circuitry monitors an optical component integrity sensing path in an optical component. If a rise in resistance of the sensing path is detected, the circuitry prevents the optical component from emitting light. The optical component may have a light-emitting device that emits light through an optical element. The sensing path may have a first path that is used to detect damage to the optical element and a second path that is coupled to a package covering the optical element and light-emitting device. The first path may have a segment formed from a metal trace on the optical element and a segment formed from a wire bond, providing mechanical compliance to tolerate strains expected in the use case. The second path ensures that the package is present to constrain movement of the optical element and its wires within a safe envelope defined by the package interior.

    Beam-Tilting Light Source Enclosures
    9.
    发明公开

    公开(公告)号:US20240069241A1

    公开(公告)日:2024-02-29

    申请号:US18388140

    申请日:2023-11-08

    申请人: Apple Inc.

    IPC分类号: G01V8/12 F21V3/02 F21V5/04

    摘要: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.