公开(公告)号：US20180082971A1

公开(公告)日：2018-03-22

申请号：US15421194

申请日：2017-01-31

Applicant: Apple Inc.

Inventor： Wei LIN ,  Nathan K. GUPTA ,  Po-Jui CHEN

IPC: H01L23/00 ,  C09J9/02 ,  C09J11/04

CPC classification number: H01L24/29 ,  C08K7/00 ,  C08K9/02 ,  C08K2003/0806 ,  C08K2003/0862 ,  C09J9/02 ,  C09J11/04 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29347 ,  H01L2224/29439 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/32227 ,  H01L2224/83201 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/07811

Abstract: Conductive adhesive films can include a binding material having a first set of conductive particles therewithin. The binding material can be electrically non-conductive and can flow between and bond external electronic components during a bonding process. The first set of conductive particles can each have cores formed of a first material, such as polymer, and coatings surrounding the cores, the coatings formed of a second material that is electrically conductive, such as nickel. The binding material can also include a second set of smaller conductive particles formed of a third material that is electrically conductive, such as copper, which can have coatings formed of a fourth material that is electrically conductive, such as silver. The first set of conductive particles can each be sphere shaped, and the second set of conductive particles can each be flake shaped. The conductive particles can form electrical paths between the external electronic components.