公开(公告)号：US20230147273A1

公开(公告)日：2023-05-11

申请号：US17821920

申请日：2022-08-24

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Jie-Hua Zhao ,  Kristopher P. Laurent ,  Michael E. Leclerc ,  Rangaraj Dhanasekaran ,  Simon J. Trivett

IPC: H01L23/00 ,  H01L25/16 ,  H01L25/065 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L23/562 ,  H01L25/16 ,  H01L25/0655 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L23/49816 ,  H01L21/4817 ,  H01L21/4853 ,  H01L24/81 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1436 ,  H01L2224/73253 ,  H01L2224/32245 ,  H01L2224/16225 ,  H01L2224/81097 ,  H01L2924/1616 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/1659

Abstract: Electronic assemblies and methods of assembly are described. In an embodiment, an electronic assembly includes a stiffener structure shear bonded to an opposite side of a module substrate from a ball grid array (BGA) package. The stiffener structure may be shear bonded at elevated temperature after bonding of the BGA package to lock in a flat or near-flat surface contour of the module substrate.