Abstract:
Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
Abstract:
An apparatus with a vessel (20), a first induction source (30), and a second induction source (32) in the melt zone (12). The first induction source (30) is used to melt the material received in the vessel (20). The second induction source (32) is used to contain the material in a meltable form within the vessel (20) during melting. The coils (26) of each of the first and second induction sources (30, 32) can be arranged such that they intertwine in an alternate fashion or that they are in sets in a series. The coils (26) of the sources (30, 32) can also sequentially receive power such that the material is moved through the ejection path after melting and into an adjacent mold. The vessel (20) can be positioned along a horizontal axis (X). The apparatus can be used to melt and mold amorphous alloys; for example.