METHODS FOR SHIELDING ELECTRONIC COMPONENTS FROM MOISTURE
    1.
    发明申请
    METHODS FOR SHIELDING ELECTRONIC COMPONENTS FROM MOISTURE 有权
    从水分屏蔽电子元件的方法

    公开(公告)号:US20150060110A1

    公开(公告)日:2015-03-05

    申请号:US14230639

    申请日:2014-03-31

    Applicant: Apple Inc.

    Abstract: Methods for applying a hydrophobic coating to various components within a computing device are disclosed. More specifically, a hydrophobic coating can be applied by a plasma assisted chemical vapor deposition (PACVD) process to a fully assembled circuit board. Frequently, a fully assembled circuit board can have various components such as electromagnetic interference (EMI) shields which cover water sensitive electronics. A method is disclosed for perforating portions of the EMI shields that overlay the water sensitive electronics. Methods of sealing board to board connectors are also disclosed. In one embodiment solder leads of the board to board connectors can be covered by a silicone seal.

    Abstract translation: 公开了将疏水涂层施加到计算装置内的各种部件的方法。 更具体地,疏水涂层可以通过等离子体辅助化学气相沉积(PACVD)方法施加到完全组装的电路板上。 通常,完全组装的电路板可以具有各种部件,例如覆盖水敏电子器件的电磁干扰(EMI)屏蔽。 公开了一种用于穿透覆盖水敏电子器件的EMI屏蔽部分的穿孔方法。 还公开了板对板连接器的密封方法。 在一个实施例中,板对板连接器的焊接引线可以被硅树脂密封覆盖。

    INDUCTIVE COIL DESIGNS FOR THE MELTING AND MOVEMENT OF AMORPHOUS METALS
    3.
    发明申请
    INDUCTIVE COIL DESIGNS FOR THE MELTING AND MOVEMENT OF AMORPHOUS METALS 审中-公开
    用于非金属熔化和运动的电感线圈设计

    公开(公告)号:US20150298207A1

    公开(公告)日:2015-10-22

    申请号:US14397590

    申请日:2012-05-04

    Applicant: Apple Inc.

    Abstract: An apparatus with a vessel (20), a first induction source (30), and a second induction source (32) in the melt zone (12). The first induction source (30) is used to melt the material received in the vessel (20). The second induction source (32) is used to contain the material in a meltable form within the vessel (20) during melting. The coils (26) of each of the first and second induction sources (30, 32) can be arranged such that they intertwine in an alternate fashion or that they are in sets in a series. The coils (26) of the sources (30, 32) can also sequentially receive power such that the material is moved through the ejection path after melting and into an adjacent mold. The vessel (20) can be positioned along a horizontal axis (X). The apparatus can be used to melt and mold amorphous alloys; for example.

    Abstract translation: 具有容器(20),第一感应源(30)和熔化区(12)中的第二感应源(32)的装置。 第一感应源(30)用于熔化容纳在容器(20)中的材料。 第二感应源(32)用于在熔化期间将容器(20)中的可熔化形式的材料容纳。 第一和第二感应源(30,32)中的每一个的线圈(26)可以被布置成使得它们以交替的方式缠绕,或者它们以串联的形式组合。 源(30,32)的线圈(26)还可以顺序地接收功率,使得材料在熔化之后移动通过喷射路径并进入相邻的模具。 容器(20)可以沿水平轴线(X)定位。 该设备可用于熔化和模塑非晶合金; 例如。

    BULK AMORPHOUS ALLOY SHEET FORMING PROCESSES
    4.
    发明申请
    BULK AMORPHOUS ALLOY SHEET FORMING PROCESSES 有权
    大块非晶合金成型工艺

    公开(公告)号:US20130306201A1

    公开(公告)日:2013-11-21

    申请号:US13939872

    申请日:2013-07-11

    CPC classification number: B22D11/06 B22D11/01 B22D11/0631 B22D25/06

    Abstract: Embodiments herein relate to a method for forming a bulk solidifying amorphous alloy sheets have different surface finish including a “fire” polish surface like that of a float glass. In one embodiment, a first molten metal alloy is poured on a second molten metal of higher density in a float chamber to form a sheet of the first molten that floats on the second molten metal and cooled to form a bulk solidifying amorphous alloy sheet. In another embodiment, a molten metal is poured on a conveyor conveying the sheet of the first molten metal on a conveyor and cooled to form a bulk solidifying amorphous alloy sheet. The cooling rate such that a time-temperature profile during the cooling does not traverse through a region bounding a crystalline region of the metal alloy in a time-temperature-transformation (TTT) diagram.

    Abstract translation: 本文的实施方案涉及用于形成大块固化非晶合金薄片的方法具有不同的表面光洁度,包括像浮法玻璃的“火”抛光表面。 在一个实施例中,将第一熔融金属合金浇注在浮法室中的较高密度的第二熔融金属上,以形成浮在第二熔融金属上的第一熔融物片,并冷却以形成大量固化的非晶态合金板。 在另一个实施例中,将熔融金属倒在输送机上的第一熔融金属片上的输送机上,并将其冷却以形成大量固化的非晶态合金板。 冷却速度使得冷却期间的时间 - 温度分布在时间 - 温度变换(TTT)图中不穿过包围金属合金的结晶区域的区域。

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