公开(公告)号：US20240105639A1

公开(公告)日：2024-03-28

申请号：US17951978

申请日：2022-09-23

Applicant: Apple Inc.

Inventor： Helia Rahmani ,  Stephane J. Marcadet ,  Scott J. Campbell ,  Zhiyong C. Xia ,  Stephen V. Jayanathan ,  Vineet Negi ,  Christian Kettenbeil

IPC: H01L23/00 ,  H01L23/053 ,  H05K1/18 ,  H05K5/00

CPC classification number: H01L23/562 ,  H01L23/053 ,  H05K1/181 ,  H05K5/0004 ,  H05K5/0091 ,  H05K2201/10378 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/10734

Abstract: Structures, methods, and apparatus for protecting interconnections between components and boards in an electronic device from damage resulting from a physical shock. This damage can occur due to differential tensile forces being applied between the component and the board during a drop or other shock event. An example can reduce or prevent damage by providing differential compression forces between the component and board that can cancel differential tensile forces between the component and board during the shock event. Another example can reduce or prevent damage by reducing differential tensile forces between a component and board. Another example can secure a component to the board to directly reduce the differential force in order to prevent damage.