公开(公告)号：US20170167007A1

公开(公告)日：2017-06-15

申请号：US15376371

申请日：2016-12-12

Applicant: Apple Inc.

Inventor： Daniel T. McDonald ,  James A. Wright ,  Wai Man Kwok

IPC: C22F1/08 ,  H01R13/03 ,  C22C9/00 ,  H01R4/58 ,  C25D3/38 ,  C25D1/00

CPC classification number: C22F1/08 ,  C22C9/00 ,  C25D1/00 ,  C25D3/38 ,  C25D3/58 ,  H01R4/58 ,  H01R13/03

Abstract: An electroformed binary copper alloy comprising copper and X, where X is selected from the group consisting of Cr, Fe, W, Mo, B, Co, Ag, and P, having a yield strength of at least 600 MPa and an electrical conductivity of at least 20% IACS is disclosed.