公开(公告)号：US20240105525A1

公开(公告)日：2024-03-28

申请号：US18358559

申请日：2023-07-25

Applicant: Apple Inc.

Inventor： Imran Hashim ,  Xiang Lu ,  Stanley B. Wang ,  Xuchun Liu ,  Mahdi Farrokh Baroughi ,  Yongjie Jiang ,  Hopil Bae ,  Hasan Akyol ,  Baris Posat ,  John T. Wetherell ,  Lei Wu

IPC: G09G3/32 ,  H01L25/075 ,  H01L33/62

CPC classification number: G09G3/32 ,  H01L25/0753 ,  H01L33/62 ,  H01L2933/0066

Abstract: Test structures and methods of testing pixel driver chip donor wafers are described. In an embodiment, a redistribution layer is formed over a pixel driver chip donor wafer and probed to determine known good dies, followed by removal of the RDL. In other embodiments, test routing is formed in the pixel driver chip using a polycide material or doped region in the semiconductor wafer.