公开(公告)号：US09907521B2

公开(公告)日：2018-03-06

申请号：US15547095

申请日：2016-01-15

Applicant: Teledyne e2v Semiconductors SAS

Inventor： Caroline Papaix ,  Florian Julien ,  Nathalie Pascal ,  Stéphane Crespin

IPC: A61B6/14 ,  A61B6/00 ,  H04N3/14 ,  A61B5/00 ,  G01T1/20

CPC classification number: A61B6/145 ,  A61B5/0088 ,  A61B6/4233 ,  A61B6/5205 ,  A61B6/545 ,  G01T1/2018 ,  H04N3/155 ,  H04N5/32 ,  H04N5/3696

Abstract: The invention relates to medical imaging and, more specifically, to intraoral dental radiology. The sensor according to the invention includes a series (SPHx) of detection photodiodes for detecting the arrival of an X-ray flash. The series of photodiodes occupies the location of a central column of the matrix of pixels. The signal of the missing pixel in each row can be reconstructed by interpolating the signals provided by the adjacent pixels of the row. The detection photodiodes are identical to the photodiodes of the active CMOS pixels. They are all electrically connected on one side to a reference potential and on the other side to a detection conductor (CD) extending along the series of photodiodes. This detection conductor is connected to a detection circuit (DX) delivering a signal for triggering the capture of an image when the detected current or the variation in this current exceeds a threshold showing that an X-ray flash has been initiated.

公开(公告)号：US20180048796A1

公开(公告)日：2018-02-15

申请号：US15673253

申请日：2017-08-09

Applicant: Apple Inc.

Inventor： Ya Wen Hsu ,  Douglas S. Brodie ,  Steven Webster

IPC: H04N5/225 ,  H04N3/14 ,  G03B13/36 ,  H04N5/235 ,  G02B13/00 ,  G02B7/09 ,  G02B27/64 ,  G03B17/14

CPC classification number: H04N5/2254 ,  G02B7/08 ,  G02B7/09 ,  G02B13/001 ,  G02B27/64 ,  G02B27/646 ,  G03B13/36 ,  G03B17/14 ,  H04N3/155 ,  H04N5/2253 ,  H04N5/235

Abstract: A camera module includes a lens barrel holder and a substrate. The substrate may include a circuit board embedded in the substrate. The circuit board may include multiple electrical components mounted to a first side of the circuit board, where the electrical components are not exposed outside. The circuit board may also include multiple electrical connections on another side of the circuit board, an image sensor mounted to the electrical connections, and an upper opening in the circuit board for light to pass through. The substrate may include an upper opening configured to receive, at least partially inside the substrate, a lower portion of the lens barrel holder. The substrate may include a lower opening connected to the upper opening and configured to receive the image sensor. The lens barrel holder may include extensions, such as a flange or tabs, and an adhesive bond between the extensions and the substrate.

公开(公告)号：US20180008214A1

公开(公告)日：2018-01-11

申请号：US15547095

申请日：2016-01-15

Applicant: Teledyne e2v Semiconductors SAS

Inventor： Caroline PAPAIX ,  Florian JULIEN ,  Nathalie PASCAL ,  Stéphane CRESPIN

IPC: A61B6/14 ,  A61B6/00 ,  A61B5/00 ,  H04N3/14 ,  G01T1/20

CPC classification number: A61B6/145 ,  A61B5/0088 ,  A61B6/4233 ,  A61B6/5205 ,  A61B6/545 ,  G01T1/2018 ,  H04N3/155 ,  H04N5/32 ,  H04N5/3696

Abstract: The invention relates to medical imaging and, more specifically, to intraoral dental radiology. The sensor according to the invention includes a series (SPHx) of detection photodiodes for detecting the arrival of an X-ray flash. The series of photodiodes occupies the location of a central column of the matrix of pixels. The signal of the missing pixel in each row can be reconstructed by interpolating the signals provided by the adjacent pixels of the row. The detection photodiodes are identical to the photodiodes of the active CMOS pixels. They are all electrically connected on one side to a reference potential and on the other side to a detection conductor (CD) extending along the series of photodiodes. This detection conductor is connected to a detection circuit (DX) delivering a signal for triggering the capture of an image when the detected current or the variation in this current exceeds a threshold showing that an X-ray flash has been initiated.

公开(公告)号：US09846122B2

公开(公告)日：2017-12-19

申请号：US15178484

申请日：2016-06-09

Applicant: Nanometrics Incorporated

Inventor： Andrzej Buczkowski ,  Mikhail Sluch

IPC: G01N21/00 ,  G01N21/64 ,  G01J3/28 ,  G01N21/47 ,  G01N21/55 ,  G01N21/88 ,  G01N21/95 ,  G01B11/06 ,  H04N3/14

CPC classification number: G01N21/6489 ,  G01B11/0625 ,  G01J3/2823 ,  G01N21/47 ,  G01N21/55 ,  G01N21/6456 ,  G01N21/88 ,  G01N21/9501 ,  G01N2021/4735 ,  G01N2021/646 ,  G01N2021/8822 ,  G01N2021/8825 ,  G01N2201/06113 ,  G01N2201/0638 ,  G01N2201/1053 ,  H04N3/155

Abstract: An optical metrology device is capable of detection of any combination of photoluminescence light, specular reflection of broadband light, and scattered light from a line across the width of a sample. The metrology device includes a first light source that produces a first illumination line on the sample. A scanning system may be used to scan an illumination spot across the sample to form the illumination line. A detector collects the photoluminescence light emitted along the illumination line. Additionally, a broadband illumination source may be used to produce a second illumination line on the sample, where the detector collects the broadband illumination reflected along the second illumination line. A signal collecting optic may collect the photoluminescence light and broadband light and focus it into a line, which is received by an optical conduit. The output end of the optical conduit has a shape that matches the entrance of the detector.

公开(公告)号：US09843741B2

公开(公告)日：2017-12-12

申请号：US15100077

申请日：2014-11-28

Applicant: The Science and Technology Facilities Council

Inventor： Marcus Julian French ,  Matthew Charles Veale

IPC: H04N5/32 ,  H01L27/146 ,  H04N5/369 ,  H04N5/372 ,  H01L27/148 ,  H04N3/14 ,  H04N5/3745

CPC classification number: H04N5/32 ,  H01L27/14609 ,  H01L27/14634 ,  H01L27/1465 ,  H01L27/14661 ,  H01L27/14806 ,  H04N3/155 ,  H04N5/369 ,  H04N5/37213 ,  H04N5/374 ,  H04N5/37452

Abstract: A hybrid pixel sensor array is provided. Each pixel of the array comprises: a sensor for generating an imaging signal; a Charged-Coupled Device (CCD) array, coupled to the sensor so as to receive samples from the imaging signal and configured for storage of a plurality of samples; and active CMOS circuitry, coupled to the CCD array for generating a pixel output signal from the stored samples. The sensors of the pixels are part of a sensor portion of the hybrid pixel sensor array that is separate from both the CCD array and active CMOS circuitry of the pixels.

公开(公告)号：US20170339362A1

公开(公告)日：2017-11-23

申请号：US15671327

申请日：2017-08-08

Applicant: OLYMPUS CORPORATION

Inventor： Yusaku Koyama

IPC: H04N5/3745 ,  H04N5/365 ,  H04N5/345 ,  H01L27/146 ,  H04N5/335 ,  H04N3/14 ,  H04N5/378 ,  H04N5/347

CPC classification number: H04N5/3745 ,  H01L27/14609 ,  H03M1/123 ,  H03M1/56 ,  H04N3/155 ,  H04N5/3355 ,  H04N5/3456 ,  H04N5/347 ,  H04N5/3658 ,  H04N5/3698 ,  H04N5/374 ,  H04N5/3765 ,  H04N5/378

Abstract: A solid-state imaging device including: a pixel array unit in which a plurality of pixels outputting an analog pixel signal are arranged in a two-dimensional matrix form; a ramp signal generation unit configured to generate and output a ramp wave; a clock generation unit configured to generate and output multiphase clocks; and a signal-processing unit, wherein the signal-processing unit including: a plurality of analog-to-digital conversion circuits, and a plurality of repeater circuits, wherein each of the plurality of analog-to-digital conversion circuits includes: a comparison unit, and a latch unit, wherein each of the plurality of the analog-to-digital conversion circuits outputs the digital value according to the state of the phase held by each latch circuit, and wherein each of the plurality of the repeater circuits corresponding to the same set are arranged side by side, and the repeater circuits are connected in series.

公开(公告)号：US20170323915A1

公开(公告)日：2017-11-09

申请号：US15524070

申请日：2015-10-29

Applicant: SONY CORPORATION

Inventor： KIYOHISA TANAKA

IPC: H01L27/146 ,  H04N1/028 ,  H04N3/14

CPC classification number: H01L27/14607 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14687 ,  H04N1/00 ,  H04N1/028 ,  H04N3/155 ,  H04N9/045

Abstract: The present technology relates to a semiconductor device and a method of manufacturing the same, a semiconductor module, and an electronic device capable of more certainly improving an optical characteristic and chromatic aberration. A semiconductor package provided with a pedestal having a cylindrical shape including a curved surface curved so as to be concave to a light incident side, and a linear image sensor on which a plurality of pixels each including a photoelectric conversion element is arranged in a one-dimensional direction, the linear image sensor fixed on the curved surface on which a light-receiving area formed of a plurality of pixels is curved so as to be concave to the light incident side is provided. The present technology may be applied to the semiconductor package used in an image reading device, for example.

公开(公告)号：US20170236863A1

公开(公告)日：2017-08-17

申请号：US15583278

申请日：2017-05-01

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yin-Kai Liao ,  Han-Chi Liu ,  Yuan-Hung Liu ,  Dun-Nian Yaung ,  Jen-Cheng Liu

IPC: H01L27/146

CPC classification number: H01L27/14629 ,  H01L21/76829 ,  H01L21/76831 ,  H01L27/14603 ,  H01L27/14614 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14683 ,  H01L27/14685 ,  H04N3/155

Abstract: A system and method for image sensing is disclosed. An embodiment comprises a substrate with a pixel region and a logic region. A first resist protect oxide (RPO) is formed over the pixel region, but not over the logic region. Silicide contacts are formed on the top of active devices formed in the pixel region, but not on the surface of the substrate in the pixel region, and silicide contacts are formed both on the top of active devices and on the surface of the substrate in the logic region. A second RPO is formed over the pixel region and the logic region, and a contact etch stop layer is formed over the second RPO. These layers help to reflect light back to the image sensor when light impinges the sensor from the backside of the substrate, and also helps prevent damage that occurs from overetching.

公开(公告)号：US09648264B2

公开(公告)日：2017-05-09

申请号：US14705783

申请日：2015-05-06

Applicant: SONY CORPORATION

Inventor： Keiji Mabuchi

IPC: H04N5/376 ,  H04N5/378 ,  H04N3/14

CPC classification number: H04N5/3765 ,  H04N3/155 ,  H04N5/23241 ,  H04N5/374 ,  H04N5/3745 ,  H04N5/378

Abstract: In a solid-state image sensing apparatus of an addressing method, a clock-conversion part generates a high-speed clock signal having a frequency two times or more the frequency of a low-speed clock signal. A signal processing part receives 10-bit pixel data through a horizontal signal line, performs predetermined signal processing, and passes parallel-format data to a switching part. The switching part selects each one bit of the parallel-format 10-bit data in a predetermined sequence to output from an output terminal using the high-speed clock signal from the clock-conversion part as a switching command, thus converts the parallel-format data into serial-format data, and passes it to an output buffer. The output buffer externally outputs differential output of normal video data and inverted video data individually from output terminals. Accordingly, the problems in power consumption, noises, and unnecessary radiation are solved, and higher-speed output is achieved.

公开(公告)号：US09584730B2

公开(公告)日：2017-02-28

申请号：US14171251

申请日：2014-02-03

Applicant: Cognex Corporation

Inventor： George Costigan ,  Laurens Nunnink ,  Aaron Wallack ,  Roger Sumner

IPC: H04N3/14 ,  H04N5/232 ,  H04N5/225 ,  H04N5/335 ,  G01M17/02 ,  G01N21/88 ,  G02B7/28 ,  G01N21/956 ,  G01B11/24

CPC classification number: H04N5/23296 ,  G01B11/24 ,  G01M17/027 ,  G01N21/8806 ,  G01N2021/95638 ,  G02B7/28 ,  H04N3/155 ,  H04N3/1562 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/335 ,  Y10T29/49002

Abstract: The disclosed apparatus, systems, and methods provide for a displacement sensor with a multi-position image sensor. The displacement sensor includes an optical lens. The displacement sensor includes an image sensor configured to view an object through the lens along a plane of focus that is not parallel to an image plane of the image sensor. The displacement sensor includes a laser for illuminating the object by the displacement sensor, wherein the laser is: spaced from the lens at a fixed distance, and configured to project a line of light along the plane of focus of the image sensor. The displacement sensor comprises a first configuration wherein the image sensor is at a first location along an image plane with a first field of view along the plane of focus, and a second configuration at a second location with a different field of view.

Abstract translation: 所公开的装置，系统和方法为具有多位置图像传感器的位移传感器提供。 位移传感器包括光学透镜。 位移传感器包括图像传感器，该图像传感器被配置为沿着不平行于图像传感器的图像平面的焦点平面通过透镜来观察物体。 位移传感器包括用于通过位移传感器照亮物体的激光器，其中激光器与透镜以固定距离间隔开，并且被配置为沿着图像传感器的焦点平面投射光线。 位移传感器包括第一配置，其中图像传感器沿着具有沿着焦平面的第一视场的图像平面处于第一位置，并且在具有不同视场的第二位置处具有第二配置。