公开(公告)号：US20240395686A1

公开(公告)日：2024-11-28

申请号：US18324612

申请日：2023-05-26

Applicant: Apple Inc.

Inventor： Wei Chen ,  Jie-Hua Zhao ,  Jun Zhai ,  Kunzhong Hu ,  Arun Sasi ,  Balaji Nandhivaram Muthuraman ,  Zezhou Liu

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/538

Abstract: Electronic packages and electronic systems are described in which a package redistribution layer of the electronic package includes structural features such a via line connections to reduce stress concentration, particularly when the package redistribution layer is formed of organic dielectric materials.