公开(公告)号：US10438896B2

公开(公告)日：2019-10-08

申请号：US15801163

申请日：2017-11-01

Applicant: Apple Inc.

Inventor： Sanjay Dabral ,  Zun Zhai

IPC: H01L23/48 ,  H01L21/44 ,  H01L23/538 ,  H01L23/488 ,  H01L23/00 ,  H01L25/18 ,  H01L23/522 ,  H01L23/58 ,  H01L21/66 ,  H01L23/528

Abstract: Stitched die structures, and methods for interconnecting die are described. In an embodiment, a stitched die structure includes a semiconductor substrate that includes a first die first die area of a first die and a second die area of a second die separate from the first die area. A back-end-of-the-line (BEOL) build-up structure spans over the first die area and the second die area, and includes a first metallic seal directly over a first peripheral area of the first die area, a second metallic seal directly over a second peripheral area of the second die area, and a die-to-die routing extending through the first metallic seal and the second metallic seal to electrically connect the first die to the second die.

公开(公告)号：US20180294230A1

公开(公告)日：2018-10-11

申请号：US15801163

申请日：2017-11-01

Applicant: Apple Inc.

Inventor： Sanjay Dabral ,  Zun Zhai

IPC: H01L23/538 ,  H01L23/488 ,  H01L23/00 ,  H01L25/18

CPC classification number: H01L23/5389 ,  H01L22/32 ,  H01L22/34 ,  H01L23/488 ,  H01L23/522 ,  H01L23/5283 ,  H01L23/58 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/73 ,  H01L24/92 ,  H01L25/18

Abstract: Stitched die structures, and methods for interconnecting die are described. In an embodiment, a stitched die structure includes a semiconductor substrate that includes a first die first die area of a first die and a second die area of a second die separate from the first die area. A back-end-of-the-line (BEOL) build-up structure spans over the first die area and the second die area, and includes a first metallic seal directly over a first peripheral area of the first die area, a second metallic seal directly over a second peripheral area of the second die area, and a die-to-die routing extending through the first metallic seal and the second metallic seal to electrically connect the first die to the second die.