公开(公告)号：US20250105051A1

公开(公告)日：2025-03-27

申请号：US18583664

申请日：2024-02-21

Applicant: Applied Materials, Inc.

Inventor： Arvinder Manmohan Singh Chadha ,  Vijay D. Parkhe ,  Glen T. Mori ,  Christopher Laurent Beaudry

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/683

Abstract: An electrostatic chuck assembly includes a first puck plate including one or more first functional elements, a second puck plate including one or more second functional elements, and an interface layer at least partially bonding the first puck plate and the second puck plate.

公开(公告)号：US20250118586A1

公开(公告)日：2025-04-10

申请号：US18377752

申请日：2023-10-06

Applicant: Applied Materials, Inc.

Inventor： Arvinder Manmohan Singh Chadha

IPC: H01L21/683 ,  B23Q3/15 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate support assembly includes a cooling plate and a chuck disposed on the cooling plate. The chuck includes one or more heating electrodes, and one or more clamp electrodes to electrostatically secure the chuck to the cooling plate. Another substrate support assembly includes a cooling plate, a first puck plate bonded to the cooling plate, and a second puck plate disposed on the first puck plate. The second puck plate includes one or more clamp electrodes to electrostatically secure the second puck plate to the first puck plate.

公开(公告)号：US20230314197A1

公开(公告)日：2023-10-05

申请号：US17855013

申请日：2022-06-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Arvinder Manmohan Singh Chadha ,  Ashley M. Okada ,  Srikanth Krishnamurthy ,  Ming Xu

IPC: G01F1/688 ,  B81B7/00 ,  B81C1/00

CPC classification number: G01F1/688 ,  B81B7/0058 ,  B81C1/00301 ,  B81B2201/0292 ,  B81B2207/093 ,  B81C2203/035 ,  B81C2203/054 ,  B81C2203/019 ,  B81C2203/036 ,  H01J37/3244

Abstract: Certain embodiments of the present disclosure relate to a sensor assembly including a substrate, a housing, and a sensor die. In certain embodiments, the substrate includes an outer region, an inner region, and a middle region between the outer region and the inner region. In certain embodiments, the substrate includes electrical contact pads on at least the inner region. In certain embodiments, the housing is coupled to the substrate at the middle region or the outer region to provide a hermetic seal. In certain embodiments, the sensor die is coupled to the substrate at the inner region via the electrical contact pads. The sensor die is aligned to the substrate via aligning features that align the sensor die relative to the substrate in at least one of a first plane or a second plane.

公开(公告)号：US20250119076A1

公开(公告)日：2025-04-10

申请号：US18377753

申请日：2023-10-06

Applicant: Applied Materials, Inc.

Inventor： Arvinder Manmohan Singh Chadha

IPC: H02N13/00 ,  H01L21/683 ,  H05K7/20

Abstract: A substrate support assembly includes a first puck plate including one or more first functional elements, and a dielectric cooling plate is bonded to the first puck plate. The dielectric cooling plate includes one or more first channels for a coolant to flow therethrough, and one or more second channels for a gas to flow therethrough.

公开(公告)号：US20250100263A1

公开(公告)日：2025-03-27

申请号：US18371972

申请日：2023-09-22

Applicant: Applied Materials, Inc.

Inventor： Arvinder Manmohan Singh Chadha ,  Chad Eric Mair

IPC: B32B37/06 ,  B32B37/08 ,  B32B37/24 ,  B32B43/00 ,  G01N21/88 ,  H01J37/32 ,  H02N13/00

Abstract: A method for bonding components of an electrostatic chuck includes applying a first melting point depressing layer (MDL) to a bottom surface of a first puck plate including one or more functional elements of an electrostatic chuck. A second MDL is applied to a top surface of a second puck plate including one or more functional elements of the electrostatic chuck, and a metal interlayer is provided between the first MDL and the second MDL. The first puck plate, the metal interlayer, and the second puck plate are aligned to form a puck assembly, and the puck assembly is heated, to a temperature at or near the eutectic temperature of the first MDL or the second MDL, to thermally bond the first puck plate to the metal interlayer and the metal interlayer to the second puck plate.