Minimal contact packaging for process chamber components

    公开(公告)号:US12100613B2

    公开(公告)日:2024-09-24

    申请号:US17131572

    申请日:2020-12-22

    CPC classification number: H01L21/68721 B65B31/024

    Abstract: Embodiments of packaged chamber components and methods of packaging chamber components are provided herein. In some embodiments, a packaged chamber component for use in a process chamber includes: an insert having an annular trench disposed about a raised inner portion, wherein the annular trench is disposed between the raised inner portion and an outer lip, wherein a ledge couples the raised inner portion to the outer lip, wherein the ledge includes a first portion and a second portion disposed radially outward of the first portion, and wherein the second portion includes a resting surface that extends upward and radially outward of an upper surface of the first portion; and a chamber component disposed in the annular trench of the insert and supported by the resting surface such that one or more critical surfaces of the chamber component are spaced apart from the insert.

Patent Agency Ranking