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公开(公告)号:US12100613B2
公开(公告)日:2024-09-24
申请号:US17131572
申请日:2020-12-22
Applicant: Applied Materials, Inc.
Inventor: Joseph Frederick Behnke , Trevor Wilantewicz , Christopher Laurent Beaudry , Timothy Douglas Toth , Scott Osterman
IPC: H01L21/687 , B65B31/02 , C23C16/458 , H01L21/67
CPC classification number: H01L21/68721 , B65B31/024
Abstract: Embodiments of packaged chamber components and methods of packaging chamber components are provided herein. In some embodiments, a packaged chamber component for use in a process chamber includes: an insert having an annular trench disposed about a raised inner portion, wherein the annular trench is disposed between the raised inner portion and an outer lip, wherein a ledge couples the raised inner portion to the outer lip, wherein the ledge includes a first portion and a second portion disposed radially outward of the first portion, and wherein the second portion includes a resting surface that extends upward and radially outward of an upper surface of the first portion; and a chamber component disposed in the annular trench of the insert and supported by the resting surface such that one or more critical surfaces of the chamber component are spaced apart from the insert.
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公开(公告)号:US20230160055A1
公开(公告)日:2023-05-25
申请号:US18089807
申请日:2022-12-28
Applicant: APPLIED MATERIALS, INC.
Inventor: Vahid Firouzdor , Christopher Laurent Beaudry , Hyun-Ho Doh , Joseph Frederick Behnke , Joseph Frederick Sommers
IPC: C23C14/08 , H01J37/32 , C23C4/134 , C23C14/00 , H01L21/67 , C23C14/22 , C04B35/486 , C04B35/505 , C04B35/622 , C04B35/111
CPC classification number: C23C14/083 , H01J37/32495 , C23C4/134 , C23C14/0052 , H01L21/67213 , C23C14/221 , C04B35/486 , C04B35/505 , C04B35/62222 , C23C14/081 , C04B35/111
Abstract: Described herein is a protective coating composition that provides erosion and corrosion resistance to a coated article (such as a chamber component) upon the article's exposure to harsh chemical environment (such as hydrogen based and/or halogen based environment) and/or upon the article's exposure to high energy plasma. Also described herein is a method of coating an article with the protective coating using electronic beam ion assisted deposition, physical vapor deposition, or plasma spray. Also described herein is a method of processing wafer, which method exhibits, on average, less than about 5 yttrium based particle defects per wafer.
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公开(公告)号:US20250027195A1
公开(公告)日:2025-01-23
申请号:US18223199
申请日:2023-07-18
Applicant: Applied Materials, Inc.
Inventor: Yogesh Tomar , Nikshep Patil , Kirubanandan Shanmugam Naina , Hanish Kumar Panavalappil Kumarankutty , Gayatri Natu , Mahesh Chelvaraj Arcot , Senthil Kumar Nattamai Subramanian , Hari Venkatesh Rajendran , Michael Rice , Christopher Laurent Beaudry
IPC: C23C16/455 , C23C16/44 , C23C16/52
Abstract: A method includes performing an atomic layer deposition (ALD) process with respect to a plurality of target elements to coat interiors of the plurality of target elements with a protective coating. Performing the ALD process includes alternating delivery of a first precursor inside the plurality of target elements for a first duration to form an adsorption layer on the interiors of the plurality of target elements, alternating purging of the first precursor from the plurality of target elements for a second duration, and alternating delivery of a second precursor inside the plurality of target elements for a third duration to cause the second precursor to react with the adsorption layer and form a target layer on the interiors of the plurality of target elements.
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公开(公告)号:US20230348290A1
公开(公告)日:2023-11-02
申请号:US18217386
申请日:2023-06-30
Applicant: Applied Materials, Inc.
Inventor: Christopher Laurent Beaudry , Vahid Firouzdor , Joseph Frederick Sommers , Trevor Edward Wilantewicz , Hyun-Ho Doh , Joseph Frederick Behnke
CPC classification number: C01F17/34 , C23C14/08 , C23C4/134 , C23C4/11 , C23C14/221 , Y10T428/12667
Abstract: Described herein is a plasma resistant protective coating composition and bulk composition that provides enhanced erosion and corrosion resistance upon the coating composition's or the bulk composition's exposure to harsh chemical environment (such as hydrogen based and/or halogen based chemistries) and/or upon the coating composition's or the bulk composition's exposure to high energy plasma. Also described herein is a method of coating an article with a plasma resistant protective coating using electronic beam ion assisted deposition, physical vapor deposition, or plasma spray. Also described herein is a method of processing wafer, which method exhibits a reduced number of yttrium based particles.
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公开(公告)号:US20220181124A1
公开(公告)日:2022-06-09
申请号:US17110596
申请日:2020-12-03
Applicant: APPLIED MATERIALS, INC.
Inventor: Ren-Guan Duan , Christopher Laurent Beaudry , Glen T. Mori
IPC: H01J37/32
Abstract: Embodiments of the disclosure relate to articles, coated chamber components, methods of coating chamber components and systems with a metal fluoride coating that includes at least one metal fluoride having a formula of M1xFw, M1xM2yFw or M1xM2yM3zFw, where at least one of M1, M2, or M3 is nickel. The metal fluoride coating can be formed directly on a substrate or on a coating of a substrate.
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公开(公告)号:US20240247379A1
公开(公告)日:2024-07-25
申请号:US18099846
申请日:2023-01-20
Applicant: Applied Materials, Inc.
Inventor: Chao Liu , David John Jorgensen , Marc Shull , Christopher Laurent Beaudry , Joseph Frederick Behnke
IPC: C23C28/00
CPC classification number: C23C28/323 , C23C28/34
Abstract: Embodiments of the disclosure relate to articles, coated chamber components, and techniques of coating chamber components and systems. In particular, disclosed is a chamber component and methods of forming the chamber component that includes a substrate and a first layer disposed on the substrate, the first layer including a metal with a first atomic concentration. The chamber component further includes a second layer disposed on the first layer, the second layer including the metal with a second atomic concentration that is at least 5 percent higher than the first atomic concentration.
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公开(公告)号:US11920234B2
公开(公告)日:2024-03-05
申请号:US18089807
申请日:2022-12-28
Applicant: APPLIED MATERIALS, INC.
Inventor: Vahid Firouzdor , Christopher Laurent Beaudry , Hyun-Ho Doh , Joseph Frederick Behnke , Joseph Frederick Sommers
IPC: H01L21/67 , C04B35/111 , C04B35/486 , C04B35/505 , C04B35/622 , C23C4/134 , C23C14/00 , C23C14/08 , C23C14/22 , H01J37/32
CPC classification number: C23C14/083 , C04B35/111 , C04B35/486 , C04B35/505 , C04B35/62222 , C23C4/134 , C23C14/0052 , C23C14/081 , C23C14/221 , H01J37/32495 , H01L21/67213
Abstract: Described herein is a protective coating composition that provides erosion and corrosion resistance to a coated article (such as a chamber component) upon the article's exposure to harsh chemical environment (such as hydrogen based and/or halogen based environment) and/or upon the article's exposure to high energy plasma. Also described herein is a method of coating an article with the protective coating using electronic beam ion assisted deposition, physical vapor deposition, or plasma spray. Also described herein is a method of processing wafer, which method exhibits, on average, less than about 5 yttrium based particle defects per wafer.
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公开(公告)号:US20210403337A1
公开(公告)日:2021-12-30
申请号:US17359343
申请日:2021-06-25
Applicant: Applied Materials, Inc.
Inventor: Christopher Laurent Beaudry , Vahid Firouzdor , Joseph Frederick Sommers , Trevor Edward Wilantewicz , Hyun-Ho Doh , Joseph Frederick Behnke
Abstract: Described herein is a plasma resistant protective coating composition and bulk composition that provides enhanced erosion and corrosion resistance upon the coating composition's or the bulk composition's exposure to harsh chemical environment (such as hydrogen based and/or halogen based chemistries) and/or upon the coating composition's or the bulk composition's exposure to high energy plasma. Also described herein is a method of coating an article with a plasma resistant protective coating using electronic beam ion assisted deposition, physical vapor deposition, or plasma spray. Also described herein is a method of processing wafer, which method exhibits a reduced number of yttrium based particles.
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公开(公告)号:US20230323531A1
公开(公告)日:2023-10-12
申请号:US18089388
申请日:2022-12-27
Applicant: Applied Materials, Inc.
Inventor: Joseph Frederick Behnke , Carlaton Wong , Albert Barrett Hicks, III , Steven Darrell Marcus , Joseph Frederick Sommers , Christopher Laurent Beaudry , Timothy Joseph Franklin
IPC: C23C16/40 , C23C16/455 , C23C16/52
CPC classification number: C23C16/403 , C23C16/45544 , C23C16/52
Abstract: A method includes affixing a supply apparatus to inlets for one or more channels of a chamber component. The channels provide one or more gas flow paths between a first side of the chamber component that comprises the inlets and a second side of the chamber component comprising outlets of the one or more channels. The method further includes affixing an exhaust apparatus to the outlets of the one or more channels. The method further includes performing a plurality of atomic layer deposition cycles to deposit a corrosion resistant coating on interior surfaces of the one or more channels of the chamber component.
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公开(公告)号:US11661650B2
公开(公告)日:2023-05-30
申请号:US16845207
申请日:2020-04-10
Applicant: APPLIED MATERIALS, INC.
Inventor: Vahid Firouzdor , Christopher Laurent Beaudry , Hyun-Ho Doh , Joseph Frederick Behnke , Joseph Frederick Sommers
IPC: C23C14/08 , C04B35/505 , C04B35/111 , H01L21/67 , H01J37/32 , C23C4/134 , C23C14/00 , C23C14/22 , C04B35/486 , C04B35/622
CPC classification number: C23C14/083 , C04B35/111 , C04B35/486 , C04B35/505 , C04B35/62222 , C23C4/134 , C23C14/0052 , C23C14/081 , C23C14/221 , H01J37/32495 , H01L21/67213
Abstract: Described herein is a protective coating composition that provides erosion and corrosion resistance to a coated article (such as a chamber component) upon the article's exposure to harsh chemical environment (such as hydrogen based and/or halogen based environment) and/or upon the article's exposure to high energy plasma. Also described herein is a method of coating an article with the protective coating using electronic beam ion assisted deposition, physical vapor deposition, or plasma spray. Also described herein is a method of processing wafer, which method exhibits, on average, less than about 5 yttrium based particle defects per wafer.
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