公开(公告)号：US20210071017A1

公开(公告)日：2021-03-11

申请号：US16681700

申请日：2019-11-12

Applicant: Applied Materials, Inc.

Inventor： Atul Bhaskar Chaudhari ,  Sivapackia Ganapathiappan ,  Srobona Sen

IPC: C09D11/102 ,  B24B37/24 ,  C08G18/10 ,  C08G18/42 ,  C08G18/67 ,  C08G18/24 ,  C09D11/30 ,  B33Y70/00

Abstract: A system, formulation, and method for additive manufacturing of a polishing layer of a polishing pad. The formulation includes a urethane acrylate oligomer based on a difunctional polyol or difunctional polythiol. The techniques includes selecting the difunctional polyol or the difunctional polythiol to affect a property of the polishing layer. The formulation also includes a monomer and a photoinitiator. The viscosity of the formulation is applicable for 3D printing of the polishing layer.

公开(公告)号：US12006442B2

公开(公告)日：2024-06-11

申请号：US16681700

申请日：2019-11-12

Applicant: Applied Materials, Inc.

Inventor： Atul Bhaskar Chaudhari ,  Sivapackia Ganapathiappan ,  Srobona Sen

IPC: B33Y70/00 ,  B24B37/24 ,  C08G18/10 ,  C08G18/24 ,  C08G18/42 ,  C08G18/67 ,  C09D11/102 ,  C09D11/30

CPC classification number: C09D11/102 ,  B24B37/24 ,  B33Y70/00 ,  C08G18/10 ,  C08G18/246 ,  C08G18/4238 ,  C08G18/6755 ,  C09D11/30

Abstract: A system, formulation, and method for additive manufacturing of a polishing layer of a polishing pad. The formulation includes a urethane acrylate oligomer based on a difunctional polyol or difunctional polythiol. The techniques includes selecting the difunctional polyol or the difunctional polythiol to affect a property of the polishing layer. The formulation also includes a monomer and a photoinitiator. The viscosity of the formulation is applicable for 3D printing of the polishing layer.

公开(公告)号：US20210069860A1

公开(公告)日：2021-03-11

申请号：US16681714

申请日：2019-11-12

Applicant: Applied Materials, Inc.

Inventor： Atul Bhaskar Chaudhari ,  Sivapackia Ganapathiappan ,  Srobona Sen

IPC: B24B53/017 ,  B24D3/00 ,  C08L75/06

Abstract: A system, formulation, and method for additive manufacturing of a polishing layer of a polishing pad. The formulation includes a urethane acrylate oligomer based on a difunctional polyol or difunctional polythiol. The techniques includes selecting the difunctional polyol or the difunctional polythiol to affect a property of the polishing layer. The formulation also includes a monomer and a photoinitiator. The viscosity of the formulation is applicable for 3D printing of the polishing layer.