公开(公告)号：US20250001547A1

公开(公告)日：2025-01-02

申请号：US18883149

申请日：2024-09-12

Applicant: Applied Materials, Inc.

Inventor： Kevin H. Song ,  Benedict W. Pang

IPC: B24B37/04 ,  B24B57/02 ,  H01L21/3105 ,  H01L21/321

Abstract: Exemplary substrate electrochemical planarization apparatuses may include a chuck body defining a substrate support surface. The apparatuses may include a retaining wall extending from the chuck body. The apparatuses may include an electrolyte delivery port disposed radially inward of the retaining wall. The apparatuses may include a spindle that is positionable over the chuck body. The apparatuses may include an end effector coupled with a lower end of the spindle. The end effector may be conductive. The apparatuses may include an electric contact extending from the chuck body or retaining wall. The apparatuses may include a current source. The current source may be configured to provide an electric current to an electrolyte within an open interior defined by the retaining wall.

公开(公告)号：US12257664B2

公开(公告)日：2025-03-25

申请号：US16800777

申请日：2020-02-25

Applicant: Applied Materials, Inc.

Inventor： Kevin H. Song ,  Benedict W. Pang

IPC: B24B37/00 ,  B24B37/005 ,  B24B37/22 ,  B24B37/26 ,  B24B37/32 ,  B24B53/00

Abstract: A polishing pad for a chemical mechanical polishing apparatus includes a polishing layer having a polishing surface and a backing layer formed of a fluid-permeable material. The backing layer includes a lower surface configured to be secured to a platen and an upper surface secured to the polishing layer, wherein the lower surface and upper surface are sealed. A first seal circumferentially seals an edge of the backing layer, and a second seal seals and separates the backing layer into a first region and a second region surrounded by the first region.

公开(公告)号：US12090600B2

公开(公告)日：2024-09-17

申请号：US17833422

申请日：2022-06-06

Applicant: Applied Materials, Inc.

Inventor： Kevin H. Song ,  Benedict W. Pang

IPC: B24B37/04 ,  B24B57/02 ,  H01L21/3105 ,  H01L21/321

CPC classification number: B24B37/046 ,  B24B37/044 ,  B24B57/02 ,  H01L21/31053 ,  H01L21/32125

Abstract: Exemplary substrate electrochemical planarization apparatuses may include a chuck body defining a substrate support surface. The apparatuses may include a retaining wall extending from the chuck body. The apparatuses may include an electrolyte delivery port disposed radially inward of the retaining wall. The apparatuses may include a spindle that is positionable over the chuck body. The apparatuses may include an end effector coupled with a lower end of the spindle. The end effector may be conductive. The apparatuses may include an electric contact extending from the chuck body or retaining wall. The apparatuses may include a current source. The current source may be configured to provide an electric current to an electrolyte within an open interior defined by the retaining wall.

公开(公告)号：US20230390887A1

公开(公告)日：2023-12-07

申请号：US17833422

申请日：2022-06-06

Applicant: Applied Materials, Inc.

Inventor： Kevin H. Song ,  Benedict W. Pang

IPC: B24B37/04 ,  H01L21/3105 ,  H01L21/321 ,  B24B57/02

CPC classification number: B24B37/046 ,  H01L21/31053 ,  H01L21/32125 ,  B24B37/044 ,  B24B57/02

Abstract: Exemplary substrate electrochemical planarization apparatuses may include a chuck body defining a substrate support surface. The apparatuses may include a retaining wall extending from the chuck body. The apparatuses may include an electrolyte delivery port disposed radially inward of the retaining wall. The apparatuses may include a spindle that is positionable over the chuck body. The apparatuses may include an end effector coupled with a lower end of the spindle. The end effector may be conductive. The apparatuses may include an electric contact extending from the chuck body or retaining wall. The apparatuses may include a current source. The current source may be configured to provide an electric current to an electrolyte within an open interior defined by the retaining wall.

公开(公告)号：US20230024009A1

公开(公告)日：2023-01-26

申请号：US17380788

申请日：2021-07-20

Applicant: Applied Materials, Inc.

Inventor： Kevin H. Song ,  Benedict W. Pang

IPC: H01L21/687 ,  H01L21/306 ,  B24B37/20

Abstract: Exemplary substrate edge polishing apparatuses may include a chuck body defining a substrate support surface. The apparatuses may include an edge ring seated on the chuck body. The apparatuses may include a retaining wall disposed radially outward of the edge ring. The apparatuses may include a slurry delivery port disposed radially inward of the retaining wall. The apparatuses may include a cylindrical spindle that is positionable over the chuck body. The apparatuses may include an annular polishing pad coupled with a lower end of the cylindrical spindle.