公开(公告)号：US20220275505A1

公开(公告)日：2022-09-01

申请号：US17187218

申请日：2021-02-26

Applicant: Applied Materials, Inc.

Inventor： Chien-Min LIAO ,  Chi-Feng LIU ,  Yi Nung WU ,  Hsiu YANG ,  Yixing LIN ,  Boon Sen CHAN ,  Siamak SALIMIAN

IPC: C23C16/44 ,  H05B1/02 ,  C23C16/455

Abstract: Methods and apparatus for a baking chamber for processing a chamber component are provided herein. In some embodiments, a baking chamber includes: an enclosure defining a first chamber, wherein the first chamber comprises: a first chamber body having a first floor and first sidewalls that couple the first floor to a first lid of the first chamber body to define a first interior volume; a first support disposed in the first interior volume; a first gas line disposed in the first interior volume proximate the first lid; a first showerhead disposed between the first gas line and the first support; a first exhaust coupled to the first floor; and a first heater disposed in the first interior volume between the first support and the first floor; and wherein the enclosure includes a door configured to facilitate transferring the chamber component into and out of the enclosure.

公开(公告)号：US20250073819A1

公开(公告)日：2025-03-06

申请号：US18242184

申请日：2023-09-05

Applicant: Applied Materials, Inc.

Inventor： Chunrong YIN ,  Ching-Pao WANG ,  Joseph LIU ,  Yixing LIN ,  Boon Sen CHAN ,  Siamak SALIMIAN

IPC: B23K26/352 ,  B23K26/082 ,  B23K26/40

Abstract: Methods and apparatus for cleaning a used component from a substrate processing chamber are provided. In some embodiments, the method includes obtaining a used component having a ceramic base and process residue that is generated as a byproduct in the substrate processing chamber and that is in direct contact with the ceramic base; and at least partially removing the process residue by scanning a laser beam across the process residue.