公开(公告)号：US20020135969A1

公开(公告)日：2002-09-26

申请号：US10095914

申请日：2002-03-12

Applicant: Applied Materials, Inc.

Inventor： Edwin C. Weldon ,  Kenneth S. Collins ,  Arik Donde ,  Brian Lue ,  Dan Maydan ,  Robert J. Steger ,  Timothy Dyer ,  Ananda H. Kumar ,  Alexander M. Veytser ,  Kadthala R. Narendrnath ,  Semyon L. Kats ,  Arnold Kholodenko ,  Shamouil Shamouilian ,  Dennis S. Grimard

IPC: H01H001/00

CPC classification number: H01J37/321 ,  C23C16/4586 ,  H01J2237/2001 ,  H01L21/6831 ,  H01L21/6833 ,  Y10T279/23

Abstract: An electrostatic chuck has an electrode capable of being electrically charged to electrostatically hold a substrate. A composite layer covers the electrode. The composite layer comprises (1) a first dielectric material covering a central portion of the electrode, and (2) a second dielectric material covering a peripheral portion of the electrode, the second dielectric material having a different composition than the composition of the first dielectric material. The chuck is useful in a plasma process chamber to process substrates, such as semiconductor wafers.

Abstract translation: 静电吸盘具有能够带电的电极，以静电保持基板。 复合层覆盖电极。 复合层包括（1）覆盖电极的中心部分的第一电介质材料，和（2）覆盖电极的周边部分的第二电介质材料，第二电介质材料的组成不同于第一电介质的组成 材料。 卡盘在等离子体处理室中可用于处理诸如半导体晶片的基板。

公开(公告)号：US20040190215A1

公开(公告)日：2004-09-30

申请号：US10767792

申请日：2004-01-28

Applicant: Applied Materials, Inc.

Inventor： Edwin C. Weldon ,  Kenneth S. Collins ,  Arik Donde ,  Brian Lue ,  Dan Maydan ,  Robert J. Steger ,  Timothy Dyer ,  Ananda H. Kumar ,  Alexander M. Veytser ,  Kadthala R. Narendrnath ,  Semyon L. Kats ,  Arnold Kholodenko ,  Shamouil Shamouilian ,  Dennis S. Grimard

IPC: H02H001/00

CPC classification number: H01J37/321 ,  C23C16/4586 ,  H01J2237/2001 ,  H01L21/6831 ,  H01L21/6833 ,  Y10T279/23

Abstract: An electrostatic chuck comprises a dielectric member comprising (i) a first layer comprising a semiconductive material, and (ii) a second layer over the first layer, the second layer comprising an insulative material. The insulative material has a higher electrical resistance than the semiconductive material. An electrode in the dielectric member is chargeable to generate an electrostatic force. The chuck is useful to hold substrates, such as semiconductor wafers, during their processing in plasma processes.

Abstract translation: 静电卡盘包括电介质构件，其包括（i）包含半导体材料的第一层，和（ii）第一层上的第二层，第二层包括绝缘材料。 绝缘材料具有比半导体材料更高的电阻。 电介质构件中的电极可充电以产生静电力。 卡盘在等离子体工艺中的处理期间用于保持诸如半导体晶片的基板。

公开(公告)号：US20030209773A1

公开(公告)日：2003-11-13

申请号：US10144216

申请日：2002-05-10

Applicant: Applied Materials, Inc.

Inventor： Brian Lue ,  Tatsuya Ishikawa ,  Liang-Guo Wang

IPC: H01L031/058

CPC classification number: G01K11/3213 ,  G01K11/20

Abstract: In at least one embodiment, the invention is a temperature sensor having a temperature sensitive material positioned within a shell. The shell has a first section and a second section, which are attached together by a non-adhesive bond. The non-adhesive bond being an atomic bond, such as a diffusion bond. The temperature sensitive material is capable of emitting a radiation signal which varies in its magnitude and character as the material's temperature changes. The shell allows transmission of the radiation signal through the shell to an external processor. Analysis of the emitted radiation signal by the processor can provide a temperature measurement. The temperature sensitive material is a phosphorescent, such as a phosphor. The shell may be made of a material which can be diffusion bonded, such materials include a silicon comprising material, a glass, a plastic, a sapphire and a quartz. The diffusion bond seals the shell, thus preventing the temperature sensitive material from being exposed to the surrounding environment. The sensor can include a stem attached to the shell. The stem is capable of transmitting and receiving radiation signals to and from the sensor by either positioning an optical fiber adjacent the sensor or by containing one or more waveguides.

Abstract translation: 在至少一个实施例中，本发明是具有位于壳体内的温度敏感材料的温度传感器。 壳体具有第一部分和第二部分，它们通过非粘结粘合在一起。 非粘合键是原子键，例如扩散键。 温度敏感材料能够发射随材料温度变化而变化的辐射信号的大小和特性。 外壳允许通过外壳将辐射信号传输到外部处理器。 由处理器分析发射的辐射信号可以提供温度测量。 感温材料是磷光体，例如磷光体。 外壳可以由可扩散粘合的材料制成，这种材料包括含硅材料，玻璃，塑料，蓝宝石和石英。 扩散接合密封外壳，从而防止温度敏感材料暴露于周围环境。 传感器可以包括连接到壳体的杆。 杆能够通过定位邻近传感器的光纤或者通过容纳一个或多个波导来传输和接收来自传感器的辐射信号。