Coated anode apparatus and associated method
    4.
    发明申请
    Coated anode apparatus and associated method 失效
    涂层阳极装置及相关方法

    公开(公告)号:US20020029973A1

    公开(公告)日:2002-03-14

    申请号:US09797040

    申请日:2001-02-28

    发明人: Dan Maydan

    摘要: An anode is configured to be used within a metal film plating apparatus. The anode has a substantially planar electric field generating portion and an electrolyte solution chemical reaction portion. The planar electric field generating portion is coated with an inert material that is impervious to the electrolyte solution. In one embodiment, the anode is formed as a perforated anode. In one aspect, the electric field generating portion is formed contiguous with the electrolyte solution chemical reaction portion. In another aspects, the planar electric field generating portion is formed as a distinct member from the electrolyte solution chemical reaction portion.

    摘要翻译: 阳极构造成用于金属镀膜设备中。 阳极具有大致平面的电场产生部分和电解质溶液化学反应部分。 平面电场产生部分涂覆有不透电解质溶液的惰性材料。 在一个实施例中,阳极形成为穿孔阳极。 一方面,电场产生部分与电解质溶液化学反应部分相邻形成。 在另一方面,平面电场产生部分形成为与电解质溶液化学反应部分不同的部件。

    Optical ready substrates
    5.
    发明申请
    Optical ready substrates 失效
    光学就绪基板

    公开(公告)号:US20040114853A1

    公开(公告)日:2004-06-17

    申请号:US10623666

    申请日:2003-07-21

    IPC分类号: G02B006/12

    摘要: An article of manufacture comprising an optical-ready substrate made of a first semiconductor layer, an insulating layer on top of the first semiconductor layer, and a second semiconductor layer on top of the insulating layer, wherein the second semiconductor layer has a top surface and is laterally divided into two regions including a first region and a second region, the top surface of the first region being of a quality that is sufficient to permit microelectronic circuitry to be formed therein and the second region including an optical signal distribution circuit formed therein, the optical signal distribution circuit made up of interconnected semiconductor photonic elements and designed to provide signals to the microelectronic circuit to be fabricated in the first region of the second semiconductor layer.

    摘要翻译: 一种制造方法,包括由第一半导体层制成的光学就绪衬底,在第一半导体层的顶部上的绝缘层和在绝缘层的顶部上的第二半导体层,其中第二半导体层具有顶表面和 横向分为包括第一区域和第二区域的两个区域,第一区域的顶表面具有足以允许在其中形成微电子电路的质量,并且第二区域包括其中形成的光信号分配电路, 所述光信号分配电路由互连的半导体光子元件组成并且被设计成向要在第二半导体层的第一区域中制造的微电子电路提供信号。

    Optical ready substrates
    6.
    发明申请
    Optical ready substrates 失效
    光学就绪基板

    公开(公告)号:US20040013338A1

    公开(公告)日:2004-01-22

    申请号:US10280505

    申请日:2002-10-25

    IPC分类号: G02B006/12

    摘要: An article of manufacture comprising an optical ready substrate made of a first semiconductor layer, an insulating layer on top of the first semiconductor layer, and a second semiconductor layer on top of the insulating layer, wherein the second semiconductor layer has a top surface and is laterally divided into two regions including a first region and a second region, the top surface of the first region being of a quality that is sufficient to permit microelectronic circuitry to be formed therein and the second region including an optical signal distribution circuit formed therein, the optical signal distribution circuit made up of interconnected semiconductor photonic elements and designed to provide signals to the microelectronic circuit to be fabricated in the first region of the second semiconductor layer.

    摘要翻译: 一种制品,包括由第一半导体层制成的光学就绪衬底,在第一半导体层的顶部上的绝缘层和在绝缘层的顶部上的第二半导体层,其中第二半导体层具有顶表面,并且是 横向分为包括第一区域和第二区域的两个区域,第一区域的顶表面的质量足以允许在其中形成微电子电路,并且第二区域包括其中形成的光信号分配电路, 光信号分配电路由互连的半导体光子元件组成,并被设计为向要在第二半导体层的第一区域中制造的微电子电路提供信号。

    Phosphorus doped copper
    7.
    发明申请
    Phosphorus doped copper 审中-公开
    磷掺杂铜

    公开(公告)号:US20020084192A1

    公开(公告)日:2002-07-04

    申请号:US10053533

    申请日:2002-01-16

    IPC分类号: C25D005/10 C25D005/02

    摘要: The present invention generally provides a method and an apparatus for forming a doped metal film on a conductive substrate. In one aspect of the invention, the deposition process comprises first depositing a phosphorus doped seed layer on a conductive substrate, and then depositing a conductive metal layer on the phosphorus doped seed layer to form a conductive film. In another aspect, the invention provides a method of processing a substrate including depositing a dielectric layer on a substrate, etching a feature into the substrate, depositing a conductive layer in the feature, depositing a phosphorus doped seed layer on the conductive barrier layer, and depositing a conductive metal layer on the phosphorus doped seed layer. In another aspect of the invention, an apparatus is provided that includes a phosphorus doped anode used for depositing a phosphorus doped metal film, such as a seed layer, in an electrochemical deposition process. The phosphorus doped anode preferably includes an enclosure providing for flow of an electrolyte therethrough, a phosphorus doped metal disposed within the enclosure, and an electrode disposed through the enclosure and in electrical connection with the phosphorus doped metal. Another aspect of the invention provides an apparatus for electrochemical deposition of a phosphorus doped metal onto a substrate includes a substrate holder adapted to hold the substrate in a position where the substrate plating surface is exposed to an electrolyte in an electrolyte container, a cathode electrically contacting the substrate plating surface, an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive the substrate plating surface, and a phosphorus doped anode electrically connected to the electrolyte.

    摘要翻译: 本发明通常提供一种在导电基板上形成掺杂金属膜的方法和装置。 在本发明的一个方面,沉积工艺包括首先在导电衬底上沉积磷掺杂种子层,然后在磷掺杂种子层上沉积导电金属层以形成导电膜。 另一方面,本发明提供一种处理衬底的方法,包括在衬底上沉积电介质层,将特征蚀刻到衬底中,在特征中沉积导电层,在导电阻挡层上沉积磷掺杂种子层,以及 在磷掺杂种子层上沉积导电金属层。 在本发明的另一方面,提供一种装置,其包括用于在电化学沉积工艺中沉积磷掺杂金属膜(例如种子层)的磷掺杂阳极。 磷掺杂阳极优选地包括提供电解质流过的外壳,设置在外壳内的磷掺杂金属,以及通过外壳设置并与磷掺杂金属电连接的电极。 本发明的另一方面提供了一种用于将磷掺杂金属电化学沉积到衬底上的设备,包括:衬底保持器,其适于将衬底保持在电镀液容器中的电解质暴露于衬底镀层表面的位置,阴极电接触 基板电镀表面,具有电解质入口的电解质容器,电解液出口和适于接收基板电镀表面的开口,以及电连接到电解质的磷掺杂阳极。

    Fabrication of silicon-on-insulator structure using plasma immersion ion implantation
    8.
    发明申请
    Fabrication of silicon-on-insulator structure using plasma immersion ion implantation 失效
    使用等离子体浸没离子注入制造绝缘体上硅结构

    公开(公告)号:US20040166612A1

    公开(公告)日:2004-08-26

    申请号:US10786410

    申请日:2004-02-24

    摘要: A method of fabricating a silicon-on-insulator structure having a silicon surface layer in a semiconductor workpiece, is carried out by maintaining the workpiece at an elevated temperature and producing an oxygen-containing plasma in the chamber while applying a bias to the workpiece and setting the bias to a level corresponding to an implant depth in the workpiece below the silicon surface layer to which oxygen atoms are to be implanted, whereby to form an oxygen-implanted layer in the workpiece having an oxygen concentration distribution generally centered at the implant depth and having a finite oxygen concentration in the silicon surface layer. The oxygen concentration in the silicon surface layer is then reduced to permit epitaxial silicon deposition.

    摘要翻译: 在半导体工件中制造具有硅表面层的绝缘体上硅结构的方法通过将工件保持在升高的温度下并在室中产生含氧等离子体,同时向工件施加偏压, 将所述偏压设置为与待注入氧原子的硅表面层下方的所述工件中的植入深度相对应的水平,由此在所述工件中形成氧注入层,所述氧注入层通常以注入深度为中心 并且在硅表面层中具有有限的氧浓度。 然后减小硅表面层中的氧浓度以允许外延硅沉积。

    Method and apparatus to improve thickness uniformity of surfaces for integrated device manufacturing
    9.
    发明申请
    Method and apparatus to improve thickness uniformity of surfaces for integrated device manufacturing 失效
    提高集成器件制造的表面厚度均匀性的方法和装置

    公开(公告)号:US20040121605A1

    公开(公告)日:2004-06-24

    申请号:US10325353

    申请日:2002-12-19

    IPC分类号: H01L021/311

    摘要: A method and apparatus for the formation of oxide in a manner having a planarizing effect on underlying material, e.g., silicon. In particular, an oxide having a nonuniform thickness profile is grown on the underlying material. The nonuniform thickness profile of the oxide is selected according to the nonuniform profile of the underlying material. Subsequent removal of the oxide leaves behind a planarized surface of the underlying material, as compared to the pre-oxidized surface.

    摘要翻译: 用于以对下层材料例如硅具有平坦化作用的方式形成氧化物的方法和装置。 特别地,在下层材料上生长具有不均匀厚度分布的氧化物。 根据下层材料的不均匀轮廓选择氧化物的不均匀厚度分布。 与预氧化表面相比,随后将氧化物除去在下面的材料的平坦化表面之后。