公开(公告)号：US20250167167A1

公开(公告)日：2025-05-22

申请号：US18408820

申请日：2024-01-10

Applicant: Applied Materials, Inc.

Inventor： Ying WANG ,  Ke ZHENG ,  Raymond HUNG ,  ChangBum YONG ,  Guan Huei SEE ,  Gaurav MEHTA

IPC: H01L23/00 ,  H01L25/00

Abstract: Methods and apparatus for substrate processing are provided. In some embodiments, a substrate processing method includes: sequentially stacking a plurality of dies on a substrate into a stacked assembly; thermally treating the plurality of dies; and stacking at least one additional die atop the thermally treated plurality of dies.

公开(公告)号：US20240213028A1

公开(公告)日：2024-06-27

申请号：US18086150

申请日：2022-12-21

Applicant: Applied Materials, Inc.

Inventor： Guan Huei SEE ,  ChangBum YONG ,  Prayudi LIANTO ,  Cheng SUN ,  Arvind SUNDARRAJAN

IPC: H01L21/3065

CPC classification number: H01L21/3065

Abstract: A method of thinning a die engaged with a substrate is disclosed, utilizing dry etching of a top surface of the die with a plasma comprising fluorine to selectively remove the top surface of the die relative to a top surface of the substrate.