公开(公告)号：US20240399425A1

公开(公告)日：2024-12-05

申请号：US18205067

申请日：2023-06-02

Applicant: Applied Materials, Inc.

Inventor： Ying WANG ,  Eric J. BERGMAN

IPC: B08B3/10 ,  B08B3/02 ,  B08B5/02

Abstract: Embodiments of the disclosure include an apparatus and method of cleaning a substrate. The disclosure describes a method of cleaning a substrate includes supplying a gas at a gas temperature and a gas mass flow rate to a nozzle. The method also includes supplying a liquid at a liquid temperature and a liquid mass flow rate to the nozzle. The method also includes mixing the gas with the liquid in the nozzle to form a fluid mixture having a mixture temperature of not more than about 10° C. below the liquid temperature. The method also includes spraying the fluid mixture onto a surface of the substrate through an orifice in the nozzle.

公开(公告)号：US20250167167A1

公开(公告)日：2025-05-22

申请号：US18408820

申请日：2024-01-10

Applicant: Applied Materials, Inc.

Inventor： Ying WANG ,  Ke ZHENG ,  Raymond HUNG ,  ChangBum YONG ,  Guan Huei SEE ,  Gaurav MEHTA

IPC: H01L23/00 ,  H01L25/00

Abstract: Methods and apparatus for substrate processing are provided. In some embodiments, a substrate processing method includes: sequentially stacking a plurality of dies on a substrate into a stacked assembly; thermally treating the plurality of dies; and stacking at least one additional die atop the thermally treated plurality of dies.

公开(公告)号：US20230129590A1

公开(公告)日：2023-04-27

申请号：US17508489

申请日：2021-10-22

Applicant: Applied Materials, Inc.

Inventor： Ying WANG ,  Ruiping WANG

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/66 ,  C23C16/513 ,  H01L21/683

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a method for hybrid bonding a wafer comprises performing a first vacuum processing procedure on the wafer disposed within a first processing chamber, obtaining at least one of moisture measurements or organic species measurements within the first processing chamber, comparing the obtained at least one of moisture measurements or organic species measurements with a predetermined threshold, and one of when a comparison of the obtained at least one of moisture measurements or organic species measurements is equal to or less than the predetermined threshold automatically performing a second vacuum processing procedure in a second processing chamber different from the first processing chamber on the wafer, or when the comparison of the obtained at least one of moisture measurements or organic species measurements is greater than the predetermined threshold automatically continuing performing the first vacuum processing procedure on the wafer.

公开(公告)号：US20230045597A1

公开(公告)日：2023-02-09

申请号：US17873284

申请日：2022-07-26

Applicant: Applied Materials, Inc.

Inventor： Ying WANG ,  Guan Huei SEE

IPC: H01L21/463 ,  H01L21/02 ,  H01L21/68

Abstract: Methods and apparatus for increasing a bonded area between an ultrathin die and a substrate. In some embodiments, the method may include cleaning the die and the substrate, placing the die on an upper surface of the substrate, compacting the die to the substrate using a downward force of at least one compacting roller on the die and the upper surface of the substrate to increase a bonded area between the die and the upper surface of the substrate, and annealing the die and the substrate. The compacting roller has a soft surface layer that engages with the die and the upper surface of the substrate. The soft surface layer has a Shore hardness of greater than approximately 30 and less than approximately 80. In some embodiments, the substrate and/or the compacting roller may rotate during contact with each other.

公开(公告)号：US20240170443A1

公开(公告)日：2024-05-23

申请号：US17989826

申请日：2022-11-18

Applicant: Applied Materials, Inc.

Inventor： Ruiping WANG ,  Ying WANG ,  Raymond HUNG ,  Guan Huei SEE

IPC: H01L23/00 ,  H01L21/67

CPC classification number: H01L24/80 ,  H01L21/67132 ,  H01L21/67173 ,  H01L2224/80011 ,  H01L2224/80013 ,  H01L2224/80019 ,  H01L2224/80895 ,  H01L2224/80896

Abstract: A process flow for bonding a die to a substrate incorporates defectivity risk management and yield promotion by reducing flow complexity. In some embodiments, the process flow may include a radiation process on a component substrate to weaken an adhesive bonding of dies from a surface of the component substrate, a first wet clean process on the component substrate after the radiation process to clean die bonding surfaces, eject and pick processes after performing the first wet clean process to remove dies from the component substrate for bonding to a substrate, a plasma activation process on the substrate, a second wet clean process after the plasma activation process on the substrate to clean a substrate bonding surface of the substrate, and a hybrid bonding process to bond die bonding surfaces of the dies to the substrate bonding surface of the substrate.

公开(公告)号：US20240136159A1

公开(公告)日：2024-04-25

申请号：US18088417

申请日：2022-12-23

Applicant: Applied Materials, Inc.

Inventor： Harish Varma PENMETHSA ,  Ying WANG ,  Xundong DAI ,  Alejandro LIZARRAGA MALDONADO ,  Chin Seng LAU

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01J37/32651 ,  H01J37/32568 ,  H01J37/32715 ,  H01L21/6836 ,  H01L21/68721 ,  H01J37/32082 ,  H01J2237/3343 ,  H01L2221/68327

Abstract: Embodiments of process kits for use in a substrate process chamber are provided herein. A process kit for a substrate process chamber including: a cover ring configured to extend over unprotected dicing tape of a tape frame substrate during use and having a central opening configured to expose a semiconductor wafer supported on the dicing tape during use; and a metallic shield disposed adjacent to at least a portion of a lower surface of the cover ring such that the metallic shield at least partially lines the lower surface.

公开(公告)号：US20240096664A1

公开(公告)日：2024-03-21

申请号：US17945910

申请日：2022-09-15

Applicant: Applied Materials, Inc.

Inventor： Ruiping WANG ,  Ying WANG ,  Guan Huei SEE ,  Ananthkrishna JUPUDI ,  Praveen Kumar CHORAGUDI

IPC: H01L21/67 ,  B08B1/00 ,  B08B3/04 ,  B08B7/00 ,  B08B13/00 ,  F26B25/14 ,  G06T1/00

CPC classification number: H01L21/67207 ,  B08B1/001 ,  B08B3/04 ,  B08B7/0035 ,  B08B13/00 ,  F26B25/14 ,  G06T1/0014 ,  H01L21/6838

Abstract: Methods and apparatus for cleaning tooling parts in a substrate processing tool are provided herein. In some embodiments, a method of cleaning tooling parts in a substrate processing tool includes placing one or more dirty tools on a holder in a bonding chamber of a multi-chamber processing tool; transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool; cleaning the one or more dirty tools in the cleaning chamber to produce one or more cleaned tools; inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool; and transferring the one or more cleaned tools to the bonding chamber

公开(公告)号：US20240071745A1

公开(公告)日：2024-02-29

申请号：US18383617

申请日：2023-10-25

Applicant: Applied Materials, Inc.

Inventor： Ying WANG ,  Guan Huei SEE ,  Gregory J. WILSON

IPC: H01L21/02 ,  B08B3/02 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/02076 ,  B08B3/02 ,  H01L21/67051 ,  H01L21/6836

Abstract: Methods, systems, and apparatus for cleaning and drying a tape-frame substrate are provided. In embodiments, an apparatus for supporting a tape-frame substrate includes a chuck having a first side and a second side opposite the first side, the first side having a convex surface configured to support the tape-frame substrate; and a plurality of channels extending through the chuck and having outlets along the first side, wherein the plurality of channels are configured to dispense fluid from the outlets along the convex surface of the first side. In embodiments, a support system includes the chuck and a holder configured to mount a tape-frame substrate to the chuck. The plurality of channels are configured to dispense fluid from the outlets and between the tape-frame substrate and the convex surface of the chuck when the tape-frame substrate is mounted to the chuck.

公开(公告)号：US20230288916A1

公开(公告)日：2023-09-14

申请号：US17692671

申请日：2022-03-11

Applicant: Applied Materials, Inc.

Inventor： Ying WANG ,  Xundong DAI ,  Guan Huei SEE ,  Ruiping WANG ,  Michael R. RICE ,  Hari Kishen PONNEKANTI ,  Nirmalya MAITY

IPC: G05B19/418 ,  H01L21/687 ,  H01L21/67

CPC classification number: G05B19/418 ,  H01L21/67121 ,  H01L21/68771 ,  H01L21/68778 ,  G05B2219/45031

Abstract: Apparatus for extending substrate queue time for hybrid bonding by preserving plasma activation. In some embodiments, the apparatus may include an environmentally controllable space with a support for holding a die or a substrate, a gas velocity accelerator that recirculates one or more gases laterally across the support, a filter, a humidifier apparatus that is fluidly connected to the environmentally controllable space, wherein the humidifier apparatus enables controllable humidity levels within the environmentally controllable space, a pressurizing apparatus fluidly connected to the humidifier apparatus on an output and fluidly connected to at least one gas supply on an input, a relative humidity (RH) sensor positioned within the environmentally controllable space, and an environment controller in communication with at least the humidifier apparatus and the RH sensor, wherein the environment controller is configured to maintain an RH level of approximately 80% to approximately 95%.

公开(公告)号：US20230274987A1

公开(公告)日：2023-08-31

申请号：US17680554

申请日：2022-02-25

Applicant: Applied Materials, Inc.

Inventor： Ruiping WANG ,  Shijing WANG ,  Selim NAHAS ,  Ying WANG ,  Guan Huei SEE

IPC: H01L21/66 ,  H01L21/67 ,  H01L21/687 ,  G05B19/4155

CPC classification number: H01L22/22 ,  G05B19/4155 ,  H01L21/67121 ,  H01L21/67259 ,  H01L21/68707 ,  G05B2219/43149 ,  G05B2219/50391

Abstract: Methods, apparatuses and systems in an integrated bonding system for optimizing bonding alignment between dies and a substrates include bonding, using a bonder of the integrated bonding system, a first die to a first substrate using preset alignment settings, transferring, using a transfer arm/robot of the integrated bonding system, the bonded die-substrate combination to an on-board inspection tool of the integrated bonding system, inspecting, at the on-board inspection tool, an alignment of the bond between the die and the substrate of the bonded die-substrate combination to determine a misalignment measure representing a misalignment of the bond between the die and the substrate of the bonded die-substrate combination, determining from the misalignment measurement, using a machine learning process, a correction measurement to be communicated to the bonder, and bonding, in the bonder, a different die to a different substrate using the determined machine-learning based correction measurement.