公开(公告)号：US20220037216A1

公开(公告)日：2022-02-03

申请号：US16944285

申请日：2020-07-31

Applicant: APPLIED MATERIALS, INC.

Inventor： Prayudi LIANTO ,  Sik Hin CHI ,  Shih-Chao HUNG ,  Pin Gian GAN ,  Ricardo Fujii VINLUAN ,  Gaurav MEHTA ,  Ramesh CHIDAMBARAM ,  Guan Huei SEE ,  Arvind SUNDARRAJAN ,  Upendra V. UMMETHALA ,  Wei Hao KEW ,  Muhammad Adli Danish Bin ABDULLAH ,  Michael Charles KUTNEY ,  Mark McTaggart WYLIE ,  Amulya Ligorio ATHAYDE ,  Glen T. MORI

IPC: H01L21/66 ,  H01L21/768 ,  H01L21/304 ,  H01L21/306 ,  H01L21/02 ,  H01L21/3105 ,  H01L21/683

Abstract: Methods and apparatus perform backside via reveal processes using a centralized control framework for multiple process tools. In some embodiments, a method for performing a backside via reveal process may include receiving process tool operational parameters from process tools involved in the backside via reveal process by a central controller, receiving sensor metrology data from at least one or more of the process tools involved in the backside via reveal process, and altering the backside reveal process based, at least in part, on the process tool operational parameters and the sensor metrology data by adjusting two or more of the process tools involved in the backside via reveal process. The profile parameters are configured to prevent backside via breakage during a chemical mechanical polishing (CMP) process.

公开(公告)号：US20250167167A1

公开(公告)日：2025-05-22

申请号：US18408820

申请日：2024-01-10

Applicant: Applied Materials, Inc.

Inventor： Ying WANG ,  Ke ZHENG ,  Raymond HUNG ,  ChangBum YONG ,  Guan Huei SEE ,  Gaurav MEHTA

IPC: H01L23/00 ,  H01L25/00

Abstract: Methods and apparatus for substrate processing are provided. In some embodiments, a substrate processing method includes: sequentially stacking a plurality of dies on a substrate into a stacked assembly; thermally treating the plurality of dies; and stacking at least one additional die atop the thermally treated plurality of dies.