公开(公告)号：US12009185B2

公开(公告)日：2024-06-11

申请号：US16269376

申请日：2019-02-06

Applicant: Applied Materials, Inc.

Inventor： Jun Ma ,  Chen-An Chen

IPC: H01L21/67 ,  C23C16/458 ,  H01J37/32 ,  H01L21/687

CPC classification number: H01J37/32724 ,  C23C16/4581 ,  C23C16/4586 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/68735 ,  H01L21/68792 ,  H01J2237/3321 ,  H01J2237/3341

Abstract: A pedestal for a semiconductor processing chamber is provided. The pedestal includes a first body comprising a ceramic material, wherein a plurality of heater elements are encapsulated within the first body, and a second body comprising a ceramic material, wherein one or more continuously curved grooves are formed in one or more surfaces of the second body. Additionally, the first body is coupled to the second body and encloses the grooves.