公开(公告)号：US20200156206A1

公开(公告)日：2020-05-21

申请号：US16690062

申请日：2019-11-20

Applicant: Applied Materials, Inc.

Inventor： Steven M. ZUNIGA ,  Jay GURUSAMY ,  Bum Jick KIM ,  Danielle LOI

IPC: B24B37/30

Abstract: A polishing system is provided, including a carrier with an offset distance. The offset distance allows a shifted carrier head to cover more surface area of the polishing surface. The offset distance effectively provides an additional rotation of the carrier head about the axis, which allows for a greater area traversed on the polishing surface, improving chemical mechanical polishing uniformity on the substrate.

公开(公告)号：US20200376700A1

公开(公告)日：2020-12-03

申请号：US16884888

申请日：2020-05-27

Applicant: Applied Materials, Inc.

Inventor： Bum Jick KIM ,  Danielle LOI ,  Jay GURUSAMY ,  Steven M. ZUNIGA

IPC: B26D3/00 ,  B26D1/02 ,  B24B37/10 ,  B24B41/04

Abstract: Embodiments of the present disclosure generally relate to methods of manufacturing polishing platens for use on a chemical mechanical polishing (CMP) system and polishing platens formed therefrom. A method of manufacturing a polishing includes positioning a polishing platen on a support of a manufacturing system. The manufacturing system includes the support and a cutting tool facing there towards. Here, the polishing platen includes a cylindrical metal body having a polymer layer disposed on a surface thereof and the polymer layer has a thickness of about 100 μm or more. The method further includes removing at least a portion of the polymer layer using the cutting tool to form a polishing pad-mounting surface. Beneficially, the method may be used to form a pad-mounting surface having a desired flatness or shape, such as a concave or convex shape.