公开(公告)号：US20200156206A1

公开(公告)日：2020-05-21

申请号：US16690062

申请日：2019-11-20

Applicant: Applied Materials, Inc.

Inventor： Steven M. ZUNIGA ,  Jay GURUSAMY ,  Bum Jick KIM ,  Danielle LOI

IPC: B24B37/30

Abstract: A polishing system is provided, including a carrier with an offset distance. The offset distance allows a shifted carrier head to cover more surface area of the polishing surface. The offset distance effectively provides an additional rotation of the carrier head about the axis, which allows for a greater area traversed on the polishing surface, improving chemical mechanical polishing uniformity on the substrate.

公开(公告)号：US20160114459A1

公开(公告)日：2016-04-28

申请号：US14523482

申请日：2014-10-24

Applicant: Applied Materials, Inc.

Inventor： Paul D. BUTTERFIELD ,  Shou-Sung CHANG ,  Bum Jick KIM

IPC: B24B53/017

CPC classification number: B24B53/017 ,  B24B1/00 ,  B24B53/02

Abstract: Polishing pad cleaning systems employing fluid outlets orientated to direct fluid under spray bodies and towards inlet ports, and related methods are disclosed. A polishing pad in combination with slurry contacts a substrate to planarize a surface of the substrate and remove substrate defects while creating debris. A spray system removes the debris from the polishing pad to prevent substrate damage and improve efficiency. By directing fluid under a spray body to the polishing pad and towards an inlet port, the debris may be entrained in the fluid and directed to an inner plenum of the spray body. The fluid-entrained debris is subsequently removed from the inner plenum through an outlet port. In this manner, the debris removal may reduce substrate defects, improve facility cleanliness, and improve pad efficiency.

Abstract translation: 公开了使用流体出口的抛光垫清洁系统，其方向为将流体引导到喷雾体和朝向入口端口，并且相关方法。 与浆料组合的抛光垫与基底接触以平坦化基底的表面并消除基底缺陷同时产生碎片。 喷雾系统从抛光垫上除去碎屑，​​以防止基材损坏并提高效率。 通过将流体在喷雾体下方引导到抛光垫并且朝向入口端口，碎屑可能被夹带在流体中并被引导到喷雾体的内部增压室。 流体夹带的碎屑随后通过出口端口从内部增压室移除。 以这种方式，碎屑去除可以减少衬底缺陷，提高设备清洁度并提高衬垫效率。

公开(公告)号：US20160167195A1

公开(公告)日：2016-06-16

申请号：US14919406

申请日：2015-10-21

Applicant: Applied Materials, Inc.

Inventor： Jie DIAO ,  Erik S. RONDUM ,  Thomas Ho Fai LI ,  Bum Jick KIM ,  Christopher Heung-Gyun LEE

IPC: B24B53/017 ,  B24B37/04

CPC classification number: B24B53/017 ,  B24B37/04 ,  B24B57/02 ,  H01L21/30625 ,  H01L21/31051 ,  H01L2224/118 ,  H01L2224/27616 ,  H01L2224/27845

Abstract: Polishing pad cleaning systems and related methods are disclosed. A rotatable platen comprising a polishing pad in combination with a fluid, such as a polishing fluid, contacts a substrate to planarize material at the surface thereof and resultantly creates debris. A cleaning system introduces a spray system to remove debris from the polishing pad to prevent substrate damage and improve efficiency, a waste removal system for removing used spray, used polishing fluid, and debris from the polishing pad, and a polishing fluid delivery system for providing fresh polishing fluid to the polishing pad, such that the substrate only receives fresh polishing fluid upon each complete rotation of the platen. In this manner, within die performance is enhanced, the range of certain CMP processes is improved, scratches and contamination are avoided for each polished substrate and for later-polished substrates, and platen temperatures are reduced.

Abstract translation: 公开了抛光垫清洁系统及相关方法。 包括与流体（例如抛光流体）组合的抛光垫的可旋转压板接触基底以在其表面平坦化材料并且导致碎屑。 清洁系统引入喷射系统以从抛光垫去除碎屑以防止基材损坏并提高效率，用于从抛光垫移除用过的喷雾，使用的抛光液和碎屑的废物去除系统以及用于提供 新鲜的抛光流体到抛光垫，使得基板在每个压板的完全旋转时仅接收新鲜的抛光液。 以这种方式，在模具性能提高的同时，某些CMP工艺的范围得到改善，避免了每个抛光衬底和后抛光衬底的划伤和污染，并降低了压板温度。

公开(公告)号：US20200376700A1

公开(公告)日：2020-12-03

申请号：US16884888

申请日：2020-05-27

Applicant: Applied Materials, Inc.

Inventor： Bum Jick KIM ,  Danielle LOI ,  Jay GURUSAMY ,  Steven M. ZUNIGA

IPC: B26D3/00 ,  B26D1/02 ,  B24B37/10 ,  B24B41/04

Abstract: Embodiments of the present disclosure generally relate to methods of manufacturing polishing platens for use on a chemical mechanical polishing (CMP) system and polishing platens formed therefrom. A method of manufacturing a polishing includes positioning a polishing platen on a support of a manufacturing system. The manufacturing system includes the support and a cutting tool facing there towards. Here, the polishing platen includes a cylindrical metal body having a polymer layer disposed on a surface thereof and the polymer layer has a thickness of about 100 μm or more. The method further includes removing at least a portion of the polymer layer using the cutting tool to form a polishing pad-mounting surface. Beneficially, the method may be used to form a pad-mounting surface having a desired flatness or shape, such as a concave or convex shape.

公开(公告)号：US20160016283A1

公开(公告)日：2016-01-21

申请号：US14530163

申请日：2014-10-31

Applicant: Applied Materials, Inc.

Inventor： Paul D. BUTTERFIELD ,  Shou-Sung CHANG ,  Bum Jick KIM

IPC: B24B53/017

CPC classification number: B24B53/017

Abstract: Vacuum cleaning systems and related methods are disclosed. A polishing pad in combination with a fluid, such as a slurry, contacts a substrate to planarize material at the surface thereof and resultantly creates debris. A cleaning system includes an enclosure body having an inlet opening which may be placed proximate to the polishing pad and an exit opening in communication with a vacuum source to remove the debris and the fluid from the polishing pad through a passageway connecting the inlet and exit openings. By including contact members secured to the enclosure body and configured to form an abutment against a working surface of the polishing pad, a Venturi effect zone between the enclosure body and the working surface of the polishing pad may be created to dislodge fluid and debris from the working surface. In this manner, scratches and contamination are avoided for later-polished substrates.

Abstract translation: 公开了真空清洁系统及相关方法。 与诸如浆料的流体结合的抛光垫与衬底接触以在其表面平坦化材料并且导致碎屑。 清洁系统包括具有可以靠近抛光垫设置的入口开口的外壳主体和与真空源连通的出口，以通过连接入口和出口的通道从抛光垫移除碎屑和流体 。 通过包括固定到外壳主体并被配置为形成与抛光垫的工作表面的抵接件的接触构件，可以产生外壳主体和抛光垫的工作表面之间的文丘里效应区，以将流体和碎屑从 工作面 以这种方式，可以避免稍后抛光的基材产生划伤和污染。