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公开(公告)号：US09687953B2
公开(公告)日：2017-06-27
申请号：US14318518
申请日：2014-06-27
Applicant: Applied Materials, Inc.
Inventor： Jennifer Y. Sun , Vahid Firouzdor , David Koonce , Biraja Prasad Kanungo
IPC: B24B31/116 , B24B33/02 , B24B31/00 , B24B5/40
CPC classification number: B24B31/006 , B23B35/00 , B23B2220/445 , B23B2226/18 , B24B5/40 , B24B31/003 , B24B31/116 , B24B33/02
Abstract: Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.
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公开(公告)号：US20150375358A1
公开(公告)日：2015-12-31
申请号：US14318518
申请日：2014-06-27
Applicant: Applied Materials, Inc.
Inventor： Jennifer Y. Sun , Vahid Firouzdor , David Koonce , Biraja Prasad Kanungo
CPC classification number: B24B31/006 , B23B35/00 , B23B2220/445 , B23B2226/18 , B24B5/40 , B24B31/003 , B24B31/116 , B24B33/02
Abstract: Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.
Abstract translation: 本文公开了用于抛光半导体处理室部件中的孔的内表面的系统和方法。 一种方法包括提供具有至少一个孔的陶瓷制品，所述陶瓷制品是用于半导体处理室的部件。 该方法还包括基于使研磨介质流过陶瓷制品的至少一个孔而研磨该至少一个孔，研磨介质包括聚合物基底和多个磨料颗粒。
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公开(公告)号：US20230339065A1
公开(公告)日：2023-10-26
申请号：US18215633
申请日：2023-06-28
Applicant: Applied Materials, Inc.
Inventor： Jennifer Y. Sun , Vahid Firouzdor , David Koonce , Biraja Prasad Kanungo
CPC classification number: B24B31/006 , B23B35/00 , B24B5/40 , B24B31/003 , B24B31/116 , B24B33/02 , B24B57/04 , B23B2220/445 , B23B2226/18
Abstract: Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 µin.
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公开(公告)号：US11724353B2
公开(公告)日：2023-08-15
申请号：US17834207
申请日：2022-06-07
Applicant: Applied Materials, Inc.
Inventor： Jennifer Y. Sun , Vahid Firouzdor , David Koonce , Biraja Prasad Kanungo
CPC classification number: B24B31/006 , B23B35/00 , B24B5/40 , B24B31/003 , B24B31/116 , B24B33/02 , B24B57/04 , B23B2220/445 , B23B2226/18
Abstract: Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 μin.
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公开(公告)号：US20190105751A1
公开(公告)日：2019-04-11
申请号：US16216796
申请日：2018-12-11
Applicant: Applied Materials, Inc.
Inventor： Jennifer Y. Sun , Vahid Firouzdor , David Koonce , Biraja Prasad Kanungo
IPC: B24B31/00 , B24B33/02 , B24B5/40 , B24B31/116
Abstract: Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.
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Patent Agency Ranking
公开(公告)号：US10189141B2
公开(公告)日：2019-01-29
申请号：US15619024
申请日：2017-06-09
Applicant: Applied Materials, Inc.
Inventor： Jennifer Y. Sun , Vahid Firouzdor , David Koonce , Biraja Prasad Kanungo
IPC: B24B5/40 , B24B31/116 , B24B33/02 , B24B31/00
Abstract: Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.
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公开(公告)号：US20170274493A1
公开(公告)日：2017-09-28
申请号：US15619024
申请日：2017-06-09
Applicant: Applied Materials, Inc.
Inventor： Jennifer Y. Sun , Vahid Firouzdor , David Koonce , Biraja Prasad Kanungo
IPC: B24B31/00 , B24B33/02 , B24B31/116 , B24B5/40
CPC classification number: B24B31/006 , B23B35/00 , B23B2220/445 , B23B2226/18 , B24B5/40 , B24B31/003 , B24B31/116 , B24B33/02
Abstract: Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.
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公开(公告)号：US12162115B2
公开(公告)日：2024-12-10
申请号：US18215633
申请日：2023-06-28
Applicant: Applied Materials, Inc.
Inventor： Jennifer Y. Sun , Vahid Firouzdor , David Koonce , Biraja Prasad Kanungo
Abstract: Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 μin.
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公开(公告)号：US20220297256A1
公开(公告)日：2022-09-22
申请号：US17834207
申请日：2022-06-07
Applicant: Applied Materials, Inc.
Inventor： Jennifer Y. Sun , Vahid Firouzdor , David Koonce , Biraja Prasad Kanungo
IPC: B24B31/00 , B24B5/40 , B23B35/00 , B24B31/116 , B24B33/02
Abstract: Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 μin.
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公开(公告)号：US11370078B2
公开(公告)日：2022-06-28
申请号：US16216796
申请日：2018-12-11
Applicant: Applied Materials, Inc.
Inventor： Jennifer Y. Sun , Vahid Firouzdor , David Koonce , Biraja Prasad Kanungo
IPC: B24B31/00 , B24B31/116 , B24B5/40 , B23B35/00 , B24B33/02
Abstract: Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.
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