公开(公告)号：US20240404848A1

公开(公告)日：2024-12-05

申请号：US18239783

申请日：2023-08-30

Applicant: Applied Materials, Inc.

Inventor： Sam KIM ,  Kon Tae PARK ,  Yao-Hung YANG ,  Michael John PERRY ,  Michael LEVKOVITCH ,  Ram Chandra PALSANIYA ,  Nitin KHURANA ,  Derek MCQUARRIE

IPC: H01L21/67 ,  H02J7/00

Abstract: Methods and apparatus for commissioning a semiconductor processing tool include connecting a mobile facilities cart to a semiconductor processing tool; supplying facilities from the mobile facilities cart to the semiconductor processing tool; and operating the semiconductor processing tool using facilities supplied by the connected mobile facilities cart.