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公开(公告)号：US20180047599A1
公开(公告)日：2018-02-15
申请号：US15674180
申请日：2017-08-10
Applicant: Applied Materials, Inc.
Inventor： Kang-Lie CHIANG , Greg A. BLACKBURN , Pallavi ZHANG , Michael D. ARMACOST , Nitin KHURANA
IPC: H01L21/67 , G01R19/165 , G01R21/06
CPC classification number: H01L21/67253 , G01R19/16576 , G01R21/06 , H01L21/67069 , H01L21/67242 , H01L21/67276
Abstract: Embodiments of the present disclosure provide a method, system, and computer program product for monitoring a service life of a chamber component. In one example, the method includes receiving one or more power measurements of a semiconductor processing chamber from one or more sensors positioned about the semiconductor processing chamber. The processor compares the one or more power measurements to one or more threshold values corresponding to the service life of the chamber component. The processor determines whether the one or more power measurements exceed the threshold values. If the processor determines that the one or more power measurements exceed the threshold values, the processor takes remedial measures for the service life of the chamber component.
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公开(公告)号：US20240404848A1
公开(公告)日：2024-12-05
申请号：US18239783
申请日：2023-08-30
Applicant: Applied Materials, Inc.
Inventor： Sam KIM , Kon Tae PARK , Yao-Hung YANG , Michael John PERRY , Michael LEVKOVITCH , Ram Chandra PALSANIYA , Nitin KHURANA , Derek MCQUARRIE
Abstract: Methods and apparatus for commissioning a semiconductor processing tool include connecting a mobile facilities cart to a semiconductor processing tool; supplying facilities from the mobile facilities cart to the semiconductor processing tool; and operating the semiconductor processing tool using facilities supplied by the connected mobile facilities cart.
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3.发明申请公开(公告)号：US20220344135A1
公开(公告)日：2022-10-27
申请号：US17242059
申请日：2021-04-27
Applicant: Applied Materials, Inc.
Inventor： Shuran SHENG , Lin ZHANG , Jiyong HUANG , Jang Seok OH , Joseph C. WERNER , Nitin KHURANA , Ganesh BALASUBRAMANIAN , Jennifer Y. SUN , Xinhai HAN , Zhijun JIANG
Abstract: Examples disclosed herein relate to a method and apparatus for cleaning and repairing a substrate support having a heater disposed therein. A method includes (a) cleaning a surface of a substrate support having a bulk layer, the substrate support is disposed in a processing environment configured to process substrates. The cleaning process includes forming a plasma at a high temperature from a cleaning gas mixture having a fluorine containing gas and oxygen. The method includes (b) removing oxygen radicals from the processing environment with a treatment plasma formed from a treatment gas mixture. The treatment gas mixture includes the fluorine containing gas. The method further includes (c) repairing an interface of the substrate support and the bulk layer with a post-treatment plasma. The post-treatment plasma is formed from a post-treatment gas mixture including a nitrogen containing gas. The high temperature is greater than or equal to about 500 degrees Celsius.
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公开(公告)号：US20190148194A1
公开(公告)日：2019-05-16
申请号：US16240318
申请日：2019-01-04
Applicant: Applied Materials, Inc.
Inventor： Kang-Lie CHIANG , Greg A. BLACKBURN , Pallavi ZHANG , Michael D. ARMACOST , Nitin KHURANA
IPC: H01L21/67 , G01R19/165 , G01R21/06
CPC classification number: H01L21/67253 , G01R19/16576 , G01R21/06 , H01L21/67069 , H01L21/67242 , H01L21/67276
Abstract: Embodiments of the present disclosure provide a method, system, and computer program product for monitoring a service life of a chamber component. In one example, the method includes receiving one or more power measurements of a semiconductor processing chamber from one or more sensors positioned about the semiconductor processing chamber. The processor compares the one or more power measurements to one or more threshold values corresponding to the service life of the chamber component. The processor determines whether the one or more power measurements exceed the threshold values. If the processor determines that the one or more power measurements exceed the threshold values, the processor takes remedial measures for the service life of the chamber component.
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