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公开(公告)号：US20220310425A1
公开(公告)日：2022-09-29
申请号：US17216203
申请日：2021-03-29
Applicant: Applied Materials, Inc.
Inventor： Eric Chin Hong Ng , Edward Wibowo Budiarto , Mehdi Vaez-Iravani , Todd Jonathan Egan , Venkatakaushik Voleti
Abstract: A method includes identifying first structure data of a first region of a substrate and receiving optical metrology data of the substrate associated with one or more substrate deposition processes in a processing chamber. The method further includes determining, based on the optical metrology data and the first structure data, a first growth rate of the first region of the substrate associated with the one or more substrate deposition processes. The method further includes predicting, based on the optical metrology data and the first growth rate, thickness data of a second region of the substrate without second structure data of the second region.
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Patent Agency Ranking
公开(公告)号：US20250125171A1
公开(公告)日：2025-04-17
申请号：US19000379
申请日：2024-12-23
Applicant: Applied Materials, Inc.
Inventor： Eric Chin Hong Ng , Edward Wibowo Budiarto , Mehdi Vaez-Iravani , Todd Jonathan Egan , Venkatakaushik Voleti
Abstract: A method includes identifying a first growth rate of a first region of a substrate associated with one or more substrate deposition processes performed in a processing chamber of substrate processing equipment. The method further includes determining, based on the first growth rate, thickness data of a second region of the substrate without second structure data of the second region. The thickness data is determined in a non-destructive manner. The method further includes causing performance of an action associated with processing one or more substrates via the processing chamber of the substrate processing equipment based on the thickness data of the second region of the substrate.
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公开(公告)号：US12098914B2
公开(公告)日：2024-09-24
申请号：US17936608
申请日：2022-09-29
Applicant: APPLIED MATERIALS, INC.
Inventor： Eric Chin Hong Ng , Todd J. Egan , Mehdi Vaez-Iravani
IPC: G01B11/30 , G01J5/00 , G01J5/0806 , G01J5/0808
CPC classification number: G01B11/303 , G01J5/0003 , G01J5/0806 , G01J5/0808
Abstract: A system includes a radiation source configured to emit a radiation beam. The system further includes a first optical sensor configured to detect a first intensity of a first portion of the radiation beam reflected from a surface of an object. The system further includes a second optical sensor configured to detect a second intensity of a second portion of the radiation beam scattered by the surface of the object. The system further includes a processing device communicatively coupled to the first optical sensor and the second optical sensor. The processing device is configured to determine at least one of a roughness or an emissivity of the surface of the object based on a comparison of the first intensity and the second intensity.
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公开(公告)号：US20250164238A1
公开(公告)日：2025-05-22
申请号：US18511021
申请日：2023-11-16
Applicant: APPLIED MATERIALS, INC.
Inventor： Eric Chin Hong Ng , Todd Jonathan Egan , Mayu Felicia Yamamura , Phillip William Peters , Christopher Beaudry , Mehdi Vaez-Iravani
Abstract: A system includes a radiation source configured to emit a radiation beam, a first optical sensor configured to detect a first intensity of a first portion of the radiation beam reflected from a surface of an object, a second optical sensor configured to detect a second intensity of a second portion of the radiation beam scattered by the surface of the object, and a third optical sensor configured to detect a third intensity of a third portion of the radiation beam scattered by the surface of the object. The system further includes a processing device communicatively coupled to the first optical sensor, the second optical sensor, and the third optical sensor. The processing device is configured to determine a roughness or an emissivity of the surface of the object based on a comparison of two or more of the first intensity, the second intensity, or the third intensity.
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公开(公告)号：US12211717B2
公开(公告)日：2025-01-28
申请号：US17216203
申请日：2021-03-29
Applicant: Applied Materials, Inc.
Inventor： Eric Chin Hong Ng , Edward Wibowo Budiarto , Mehdi Vaez-Iravani , Todd Jonathan Egan , Venkatakaushik Voleti
Abstract: A method includes identifying first structure data of a first region of a substrate and receiving optical metrology data of the substrate associated with one or more substrate deposition processes in a processing chamber. The method further includes determining, based on the optical metrology data and the first structure data, a first growth rate of the first region of the substrate associated with the one or more substrate deposition processes. The method further includes predicting, based on the optical metrology data and the first growth rate, thickness data of a second region of the substrate without second structure data of the second region.
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公开(公告)号：US20240110782A1
公开(公告)日：2024-04-04
申请号：US17936608
申请日：2022-09-29
Applicant: APPLIED MATERIALS, INC.
Inventor： Eric Chin Hong Ng , Todd J. Egan , Mehdi Vaez-Iravani
IPC: G01B11/30 , G01J5/00 , G01J5/0806 , G01J5/0808
CPC classification number: G01B11/303 , G01J5/0003 , G01J5/0806 , G01J5/0808
Abstract: A system includes a radiation source configured to emit a radiation beam. The system further includes a first optical sensor configured to detect a first intensity of a first portion of the radiation beam reflected from a surface of an object. The system further includes a second optical sensor configured to detect a second intensity of a second portion of the radiation beam scattered by the surface of the object. The system further includes a processing device communicatively coupled to the first optical sensor and the second optical sensor. The processing device is configured to determine at least one of a roughness or an emissivity of the surface of the object based on a comparison of the first intensity and the second intensity.
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