公开(公告)号：US20190326098A1

公开(公告)日：2019-10-24

申请号：US15958478

申请日：2018-04-20

Applicant: Applied Materials, Inc.

Inventor： Hanh NGUYEN ,  Thai Cheng CHUA ,  Philip Allan KRAUS

IPC: H01J37/32

Abstract: Embodiments described herein include a processing tool that comprises a processing chamber, a chuck for supporting a substrate in the processing chamber, a dielectric window forming a portion of the processing chamber, and a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source comprises a plurality of high-frequency emission modules. In an embodiment, each high-frequency emission module comprises, an oscillator module, amplification module, and an applicator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, the applicator is positioned proximate to the dielectric window.

公开(公告)号：US20190326095A1

公开(公告)日：2019-10-24

申请号：US15958470

申请日：2018-04-20

Applicant: Applied Materials, Inc.

Inventor： Thai Cheng CHUA ,  Christian AMORMINO ,  Hanh NGUYEN ,  Kallol BERA ,  Philip Allan KRAUS

IPC: H01J37/32

Abstract: Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises and oscillator module, an amplification module, and an applicator. In an embodiment the oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, each high-frequency emission module includes a different oscillator module.

公开(公告)号：US20160005631A1

公开(公告)日：2016-01-07

申请号：US14771494

申请日：2014-03-07

Applicant: APPLIED MATERIALS, INC.

Inventor： Joe GRIFFITH CRUZ ,  Hanh NGUYEN ,  Randy VRANA ,  Karl ARMSTRONG

IPC: H01L21/67

CPC classification number: H01L21/67109 ,  C23C16/271 ,  H01L21/67017 ,  H01L21/68785

Abstract: Apparatus for coupling a hot wire source to a process chamber is provided herein. In some embodiments, an apparatus for coupling a hot wire source to a process chamber may include: a housing having an open end and a through hole formed through a top and a bottom of the housing; and a filament assembly configured to be disposed within the housing, the filament assembly having a frame and a plurality of filaments disposed across the frame, wherein the plurality of filaments of the filament assembly are substantially parallel with the top and the bottom of the housing and at least a portion of the plurality of filaments are disposed within the through hole of the housing when the filament assembly is disposed within the housing.

Abstract translation: 本文提供了用于将热丝源耦合到处理室的装置。 在一些实施例中，用于将热丝源耦合到处理室的装置可以包括：具有开口端的壳体和穿过壳体的顶部和底部形成的通孔; 以及灯丝组件，其被配置为设置在所述壳体内，所述灯丝组件具有框架和布置在所述框架周围的多个细丝，其中所述灯丝组件的所述多根细丝基本上平行于所述壳体的顶部和底部， 当灯丝组件设置在壳体内时，多个细丝的至少一部分设置在壳体的通孔内。