公开(公告)号：US20230306300A1

公开(公告)日：2023-09-28

申请号：US17704298

申请日：2022-03-25

Applicant: Applied Materials, Inc.

Inventor： Ping-Yu Chou ,  Ya-Chu Chang ,  Jui-Che Lin ,  Hao-Wei Peng ,  Chao-Hsien Lee ,  Shauh-Teh Juang

IPC: G06N20/00

CPC classification number: G06N20/00

Abstract: An electronic device manufacturing system configured to obtain sensor data associated with a deposition process performed in a process chamber to deposit a film stack on a surface of a substrate. The film stack can include a known film pattern and an unknown film pattern. The manufacturing system is further configured to input the sensor data into a first trained machine-learning model to obtain a first output value of the first trained machine-learning model. The first output value can be associated with the known film pattern. The manufacturing system is further configured to input the first output value into a second trained machine-learning model to obtain a second output value of the second trained machine-learning model. The second output value can be indicative of metrology data of the known film pattern.

公开(公告)号：US20230342016A1

公开(公告)日：2023-10-26

申请号：US17728021

申请日：2022-04-25

Applicant: Applied Materials, Inc.

Inventor： Jui-Che Lin ,  Yan-Jhu Chen ,  Chao-Hsien Lee ,  Shauh-Teh Juang ,  Pengyu Han ,  Wallace Wang

IPC: G06F3/04847 ,  G06F3/0481 ,  H01L21/02

CPC classification number: G06F3/04847 ,  G06F3/0481 ,  H01L21/02104

Abstract: An electronic device manufacturing system configured to receive, by a processor, input data reflecting a feature related to a manufacturing process of a substrate. The manufacturing system is further configured to train a machine-learning model based on the input data reflecting the feature. The manufacturing system is further configured to modify the machine-learning model in view of the virtual knob for the feature.

公开(公告)号：US20230384777A1

公开(公告)日：2023-11-30

申请号：US17824282

申请日：2022-05-25

Applicant: Applied Materials, Inc.

Inventor： Jui-Che Lin ,  Chao-Hsien Lee ,  Shauh-Teh Juang

IPC: G05B19/418

CPC classification number: G05B19/41885 ,  G05B19/4183 ,  G05B19/41875

Abstract: An electronic device manufacturing system configured to receive, by a processor, input data reflecting a feature related to a manufacturing process of a substrate. The manufacturing system is further configured to generate a characteristic sequence defining a relationship between at least two manufacturing parameters, and determine a relationship between one or more variables related to the feature and the characteristic sequence. The manufacturing system is further configured to determine a weight based on the determined relationship and apply the weight to the feature. The manufacturing system is further configured to train a machine-learning model in view of the weighted feature.

公开(公告)号：US12236077B2

公开(公告)日：2025-02-25

申请号：US17728021

申请日：2022-04-25

Applicant: Applied Materials, Inc.

Inventor： Jui-Che Lin ,  Yan-Jhu Chen ,  Chao-Hsien Lee ,  Shauh-Teh Juang ,  Pengyu Han ,  Wallace Wang

IPC: G06F3/04847 ,  G06F3/0481 ,  H01L21/02

Abstract: An electronic device manufacturing system configured to receive, by a processor, input data reflecting a feature related to a manufacturing process of a substrate. The manufacturing system is further configured to train a machine-learning model based on the input data reflecting the feature. The manufacturing system is further configured to modify the machine-learning model in view of the virtual knob for the feature.