公开(公告)号：US20240222142A1

公开(公告)日：2024-07-04

申请号：US18089632

申请日：2022-12-28

Applicant: Applied Materials, Inc.

Inventor： Tapash CHAKRABORTY ,  Steven VERHAVERBEKE ,  Han-Wen CHEN ,  Kyuil CHO ,  Kent ZHAO ,  Gopi Chandran RAMACHANDRAN

IPC: H01L21/48 ,  H01L23/538 ,  H10B80/00

CPC classification number: H01L21/486 ,  H01L23/5384 ,  H01L23/5389 ,  H10B80/00

Abstract: Semiconductor packages and methods for metallization of non-conducting surfaces for fabricating semiconductor packages are provided. In an embodiment, the method includes depositing an adhesion layer on a polymeric surface by an electroless deposition process. The polymeric surface defines a sidewall of a through-hole via and the adhesion layer comprises a cobalt alloy or a nickel alloy. The method further includes depositing a copper seed layer on the adhesion layer by an immersion plating process. The copper seed layer displaces a portion of the adhesion layer. The method further includes filling the through-hole via with a copper containing layer.