专利检索 ap:("Applied Materials, Inc.") AND inv:"Kevin H. SONG" 第 1 页

1.

发明公开
SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE 审中-公开

公开(公告)号：US20230339066A1

公开(公告)日：2023-10-26

申请号：US18215267

申请日：2023-06-28

申请人： Applied Materials, Inc.

发明人： Justin H. WONG , Kevin H. SONG

IPC分类号： B24B37/10 , B24B49/12 , B24B37/20 , B24B37/015 , B24B37/32 , B24B37/013 , B24B57/02

CPC分类号： B24B37/013 , B24B37/015 , B24B37/105 , B24B37/205 , B24B49/12 , B24B57/02 , B24B37/32

摘要： A method and apparatus for dispensing polishing fluids and onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP system with a first fluid delivery arm and a second fluid delivery arm disposed over the polishing pad to dispense liquid, such as a polishing fluid or water. The first fluid delivery arm is disposed over at least 50% of the radius of the polishing pad, while the second fluid delivery arm is disposed over less than 50% of the radius of the polishing pad. The second fluid delivery arm is configured to dispense either a polishing fluid or a water onto the polishing pad to effect the polishing rate at the edge of the substrate.

2.

发明申请
SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE 有权

公开(公告)号：US20220097198A1

公开(公告)日：2022-03-31

申请号：US17038793

申请日：2020-09-30

申请人： Applied Materials, Inc.

发明人： Justin H. WONG , Kevin H. SONG

IPC分类号： B24B37/013 , B24B37/015 , B24B37/10 , B24B37/20 , B24B49/12 , B24B57/02

摘要： A method and apparatus for dispensing polishing fluids and onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP system with a first fluid delivery arm and a second fluid delivery arm disposed over the polishing pad to dispense liquid, such as a polishing fluid or water. The first fluid delivery arm is disposed over at least 50% of the radius of the polishing pad, while the second fluid delivery arm is disposed over less than 50% of the radius of the polishing pad. The second fluid delivery arm is configured to dispense either a polishing fluid or a water onto the polishing pad to effect the polishing rate at the edge of the substrate.